Heat energy circulation baking equipment for electronic components

Abstract

The invention provides heat energy circulation baking equipment for electronic components. The heat energy circulation baking equipment comprises a bottom plate and a sliding plate. Two groups of rail grooves are symmetrically formed in the upper end face of the bottom plate, two groups of side plates are symmetrically arranged on the left and right sides of the bottom plate, and the top ends of the two groups of side plates are fixedly connected with a top plate. An air suction pipe is arranged at the upper end of the top plate, and a fan is arranged in the air suction pipe. The air suction pipe is fixedly connected with a drying box, and an air inlet pipe is arranged at the lower end of the drying box. The sliding plate is clamped in a rail groove in the upper end face of the bottom plate in a sliding mode. Four fixing rods are symmetrically arranged on the upper end face of the sliding plate, and the fixing rings are connected into the fixing rods in a sleeved mode. According to the heat energy circulation baking equipment, through the arrangement that the outer ends of the fixing rods are sleeved with the fixing rings, the height of a lifting plate can be flexibly adjusted according to the sizes of electronic components, so that the internal space of the baking box can be better utilized, the number of components baked at a time is increased, then fixing bolts penetrate through threaded holes to fasten the fixing rings, the operation is easy, and operation by an employee is facilitated.

Description

technical field [0001] The invention belongs to the technical field of electronic machinery, and more specifically relates to a heat cycle baking equipment for electronic components. Background technique [0002] The baking of electronic components is mainly the baking of IC and BGA integrated circuit components. When the device encounters a high-temperature process after being damp, the moisture in the gaps inside the device will vaporize, and the moisture volume will increase sharply. Cause device expansion, because IC, BGA and other devices are composed of rigid materials, they cannot be restored to their original shape after collision, resulting in internal stress imbalance of the device, which in turn causes cracking, delamination, etc., seriously affecting the quality of the device. [0003] You can refer to the patent application number CN201510570147.9, which discloses a baking device. The baking equipment of the present invention comprises an oven (1), a shutter (2...

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above technical problems, the present invention provides a heat cycle baking equipment for electronic components to solve the problem of poor air fluidity inside the existing baking equipment, which leads to an increase in the humidity inside the oven after a long time of baking, resulting in a decrease in the baking effect , and when baking different parts, the problem of low utilization of the internal space of the oven is caused by the different sizes and heights of the parts

Images