Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multilayer interconnected electronic circuit board

A technology for electronic circuit boards and circuits, applied in the directions of printed circuits, printed circuit components, circuit inspection/identification, etc., can solve the problems of low utilization rate and high cost of circuit boards, improve material utilization rate, high product quality, and speed up The effect of inflow velocity

Pending Publication Date: 2020-12-04
成都大超科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the actual intersecting lines are relatively simple and few, using a circuit board with a large area will cause the disadvantages of low utilization rate and high cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer interconnected electronic circuit board
  • Multilayer interconnected electronic circuit board
  • Multilayer interconnected electronic circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] see figure 1 and figure 2 , the first embodiment of the present invention provides a multilayer interconnection electronic circuit board 1, the multilayer interconnection electronic circuit board 1 includes a main board 11 and one or more jumper boards 12, and the jumper boards 12 are far away from the main board One side of 11 is provided with a jumper line (not shown in the figure), and the side of the jumper board 12 close to the main board 11 is provided with a plurality of docking pads 121, and the butt pads 121 are provided with via holes 1211, The connecting pad 12...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a multilayer interconnected electronic circuit board, which comprises a main board and one or more jumper boards, wherein each jumper board is a double-sided board, the area of each jumper board is smaller than that of the main board, one surface of each jumper board is provided with a jumper circuit, the other surface of the jumper circuit is provided with a plurality ofbutt-joint bonding pads, via holes are formed in the butt-joint bonding pads, the butt-joint bonding pads are communicated with the jumper circuits through the via holes, the main board is provided with a plurality of bonding pads corresponding to the butt-joint bonding pads, and the butt-joint bonding pads are connected with the bonding pads in a one-to-one correspondence manner. According to themultilayer interconnected electronic circuit board, the material utilization rate is high, and the cost can be effectively reduced.

Description

【Technical field】 [0001] The invention belongs to the technical field of circuit boards, in particular to a multilayer interconnected electronic circuit board. 【Background technique】 [0002] Whether it is a printed circuit board or a flexible circuit board, there is a problem of line crossing, but the wiring cannot be crossed, so it is necessary to mount another circuit board on one circuit board, and the unavoidable crossing lines are placed on another circuit board. Arrangement without crossing. When the actual intersecting lines are relatively simple and few, using a circuit board with a large area will cause the disadvantages of low utilization rate and high cost. 【Content of invention】 [0003] In order to overcome the problems in the prior art, the present invention provides a multilayer interconnected electronic circuit board. [0004] The solution of the present invention to solve the technical problem is to provide a multi-layer interconnected electronic circui...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K1/11H05K1/02
CPCH05K1/141H05K1/111H05K1/115H05K1/147H05K1/02H05K1/0268
Inventor 张千向勇胡潇然游梦丽易娜
Owner 成都大超科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com