A kind of processing method of vapor deposition of base film for capacitor

Abstract

The invention discloses a method for processing base film vapor deposition for capacitors. The base film raw material is sleeved on the first roller bar of a film pulling device, and at the same time, one end of the base film raw material is passed through a film inlet groove on the casing of a box body. Use the film pulling device to stretch the base film raw material, so that the stretched base film raw material is discharged from the outlet groove of the box shell, and at the same time rotate the fastening latch between the first leg, the second leg and the cutting board, Loosen between the first leg, the second leg and the cutting board, cooperate with the longitudinal chute of the first leg and the second leg, and adjust the cutting board between the first leg and the second leg Position; the present invention is a method for processing base film evaporation for capacitors, so that the processing method can complete the cutting operation of multiple base films at one time during the base film processing process, while avoiding the inclination of the base film during the cutting process Phenomenon, improve the use effect of the processing method.

Description

technical field [0001] The invention belongs to the technical field of base film processing, and more specifically relates to a base film evaporation processing method for capacitors. Background technique [0002] The base film evaporation processing method for capacitors is a base film processing method that performs metal coating operations on capacitor base films through stretching and adsorption methods. Two conductors that are close to each other are sandwiched by a non-conductive layer. The insulating medium that constitutes the capacitor. [0003] The reference document CN108538582A discloses an improved metallized safety film, including a base film, a thickened coating strip evaporated on the evaporation surface of the base film, a grid-shaped safety film area electrically connected to the thickened coating strip, and The blank edge band on the other side of the safety film area; the safety film area includes coating units arranged in a matrix, vertical and horizont...

AI Technical Summary

Problems solved by technology

[0004] The existing processing method of base film evaporation for capacitors has certain disadvantages in the process of use. The traditional processing method of base film evaporation for capacitors does not have a lifting adjustment structure. When the user uses the traditional processing method to pull the base film During the stretching and cutting operation, the cutting operation of multiple base films cannot be completed at one time, thereby reducing the scope of application of this processing method in the base film cutting operation; This reduces the flexibility of the traditional processing method of base film evaporation for capacitors when cutting materials, and brings certain adverse effects to users.

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