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IC chip calibration method, system and device

A calibration system and chip technology, applied in semiconductor/solid-state device testing/measurement, electronic circuit testing, electrical components, etc., can solve the problems of high precision, contact impedance deviation, IC parameter deviation, etc., to improve calibration accuracy, The effect of eliminating calibration deviation and simple operation

Active Publication Date: 2021-01-01
SHENZHEN INJOINIC TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the applicant found that the current calibration of IC chips before leaving the factory is generally to install the IC to be calibrated on the test fixture, and then connect the peripheral calibration circuit for calibration. Since the test fixture will bring the deviation of the contact impedance, after a long time test It will even be weak, which will bring greater deviation to the IC. When the IC is soldered to the finished printed circuit board (Printed Circuit Board, PCB), it will also give the IC due to the impedance and difference of the PCB wiring. Various parameters bring deviations, which cannot meet the requirements of high precision

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  • IC chip calibration method, system and device
  • IC chip calibration method, system and device
  • IC chip calibration method, system and device

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Embodiment Construction

[0044] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0045] The terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method...

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Abstract

The application relates to a method, system and device for calibrating an IC chip. The IC to be calibrated is assembled on a finished PCB, and then the port on the PCB is connected to a calibration circuit for voltage calibration. In this way, the voltage calibration and current calibration of the IC can be directly performed on the finished IC, eliminating the calibration deviation caused by the test fixture and PCB traces of the traditional calibration method, effectively improving the calibration accuracy, and avoiding the traditional calibration method. The risk of damage caused by the IC, the quality of the factory IC is more guaranteed, and at the same time, by using the port on the finished product to calibrate the finished product after mass production, there is no need to dismantle the shell, the operation is simple and easy, which greatly reduces the cost and shortens the development cycle.

Description

technical field [0001] The present application belongs to the field of chip technology, and in particular relates to a calibration method, system and device for an IC chip. Background technique [0002] Due to deviations in wafer manufacturing, integrated circuit (Integrated Circuit Chip, IC) chips need to calibrate various internal parameters before leaving the factory. For the DC converter DCDC chip and protocol chip in the vehicle fast charging system, the output voltage and output current are the main parameters, which must be calibrated, and the output current is generally understood as the corresponding over current protection (over current protectIOn, OCP )point. [0003] However, the applicant found that the current calibration of IC chips before leaving the factory is generally to install the IC to be calibrated on the test fixture, and then connect the peripheral calibration circuit for calibration. Since the test fixture will bring the deviation of the contact im...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCH01L22/14H01L22/34H01L22/20
Inventor 丁淼
Owner SHENZHEN INJOINIC TECH
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