Package chip clamp capable of avoiding blockage

Abstract

The invention discloses a package chip clamp capable of avoiding blockage. The package chip clamp comprises a top plate and elastic clamping plates formed at the two sides of the top plate in a bent mode. A supporting plate abuts against the inner side wall of each elastic clamping plate; a supporting shaft is formed in the middle of each supporting plate; the supporting shafts run through the corresponding elastic clamping plates; an arc-shaped guide groove is formed in the elastic clamping plate at the lower side of each supporting shaft; a cylindrical driving lever is inserted into the guide groove; a spring is fixedly connected to the driving lever; the other end of the spring is fixed to a support block; a strip-shaped containing groove extending in the axial direction of the drivinglever is formed in the driving lever; a connecting shaft is inserted and fixed to one end of the containing groove; a lantern ring arranged on the connecting shaft in a sleeving mode is formed at oneend of the connecting rod, and the connecting rod can be inserted in the containing groove; an arc-shaped positioning plate is formed at the other end of the connecting rod; a magnet layer is arranged on the inner wall of the positioning plate; and the positioning plate is arranged on the outer wall of the supporting shaft in a sleeving mode, and the magnet layer is attracted to the supporting shaft. The clamp is not blocked by a barrier and advances along a production line, and lead soaking of two sides or a single side of a package chip can be realized.

Description

technical field [0001] The invention relates to the technical field of chip packaging equipment, in particular to a jig for packaged chips that avoids being blocked. Background technique [0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, flash removal, electroplating annealing, rib cutting and molding, etc. Flash removal refers to the removal of the injection plastic remaining between the leads around the chip after injection molding of the chip. Existing excess flash is removed by cutting, but cutting is easy to damage the leads. Therefore, it is proposed to use weak acid to immerse the lead part and soak the flash together. , and then rinse with high-pressure water to wash away the overflow. The existing overflow soaking is manually immersed, and then the parts are picked up manually. . In the production line of the soaking structure, the jig...

AI Technical Summary

Problems solved by technology

Flash removal refers to the removal of the injection plastic remaining between the leads around the chip after injection molding of the chip. Existing excess flash is removed by cutting, but cutting is easy to damage the leads. Therefore, it is proposed to use weak acid to immerse the lead part and soak the flash together. , and then rinse with high-pressure water to wash away the overflow. The existing overflow soaking is manually immersed, and then the parts are picked up manually.

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