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Resin molding device and method for manufacturing resin molded product

A technology of resin molding and molding dies, which is applied in the field of resin molding devices, and can solve problems such as damage to molded products, resin generation, and burrs

Active Publication Date: 2022-03-15
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the above-mentioned resin molding device, during resin molding, the injection pressure (transmission pressure) of the resin by the plunger acts in the direction of opening the mold as a back pressure (back pressure), so it may act on the molded product. Clamping pressure changes, resulting in resin burrs
In addition, it is also conceivable to set the clamping pressure to be relatively large in consideration of the back pressure, but if this is the case, the molded product may be damaged.

Method used

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  • Resin molding device and method for manufacturing resin molded product
  • Resin molding device and method for manufacturing resin molded product
  • Resin molding device and method for manufacturing resin molded product

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Experimental program
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Embodiment Construction

[0051] Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

[0052] As described above, the resin molding device of the present invention includes: a mold clamping mechanism for clamping the forming mold; a plunger driving mechanism for moving the plunger in the barrel of the forming mold; a clamping pressure detection unit for detecting the the clamping pressure of the mold clamping mechanism on the forming mold; the transmission pressure detection unit detects the transmission pressure of the plunger driving mechanism on the resin; and the control unit detects the clamping pressure based on the clamping pressure detection unit pressure and the transmission pressure detected by the transmission pressure detector to control the mold clamping mechanism, and the control unit adjusts the clamping pressure according to the transmission pressure when the detected transmission pressur...

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Abstract

The present invention provides a resin molding device and a method for manufacturing a resin molded product. The present invention reduces the influence of the back pressure caused by the transmission pressure and improves the resin molded product, including: a mold clamping mechanism for clamping the forming mold and the forming mold; a plunger driving mechanism for moving the plunger in the barrel of the forming mold The clamping pressure detection part detects the clamping pressure of the mold clamping mechanism on the forming mold; the transmission pressure detection part detects the transmission pressure of the plunger drive mechanism to the resin; and the control part detects the clamping pressure based on the clamping pressure detection part. The clamping force and the transmission pressure detected by the transmission pressure detection unit are used to control the mold clamping mechanism. When the detected transmission pressure increases, the control unit controls the mold clamping mechanism so that the clamping pressure increases corresponding to the transmission pressure. And when the detected transmission pressure drops, the mold clamping mechanism is controlled so that the clamping pressure becomes a predetermined value regardless of the transmission pressure.

Description

technical field [0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background technique [0002] Regarding the resin molding apparatus for performing resin molding by transfer molding, there is a resin molding apparatus in which a molded product is clamped between a lower mold and an upper mold, and a molded product is formed on the lower mold by a plunger. The resin is fed by pressure from a pot, and the resin is supplied to the cavity formed between the lower mold and the upper mold to perform resin sealing. [0003] In the above-mentioned resin molding device, during resin molding, the injection pressure (transmission pressure) of the resin by the plunger acts in the direction of opening the mold as a back pressure (back pressure), so it may act on the molded product. Clamping pressure changes, resulting in resin burrs. In addition, it is conceivable to set the clamping pressure relatively high in consid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/77B29C45/02
CPCB29C45/77B29C45/021B29C2945/76498B29C45/7653
Inventor 小河冬彦奥西祥人
Owner TOWA
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