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Water-cooled computer mainframe box and cooling method thereof

A computer and main box technology, applied in the computer field, can solve the problem of low heat dissipation efficiency of the main box, and achieve the effect of accelerating heat dissipation efficiency and speeding up the flow speed

Inactive Publication Date: 2020-05-05
崔永平
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  • Application Information

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Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a water-cooled computer main box with turbulent flow and two-way ventilation, which solves the problem of low heat dissipation efficiency of the main box

Method used

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  • Water-cooled computer mainframe box and cooling method thereof
  • Water-cooled computer mainframe box and cooling method thereof
  • Water-cooled computer mainframe box and cooling method thereof

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Embodiment Construction

[0030]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] see Figure 1-6 , the present invention provides a technical solution: a spoiler-type two-way ventilated water-cooled computer mainframe box, including a box body 1, the top of the inner wall of the box body 1 is fixedly connected with a total drive mechanism 2, and the two sides of the box body 1 are respectively provided with Several air holes 3 and several air inlet holes 4, the air holes 3 are three groups, and the number of each group of air holes 3...

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Abstract

The invention relates to the technical field of computers, in particular to a water-cooled computer mainframe box and a cooling method thereof. The technical problem to be solved by the invention is that the heat dissipation efficiency of the mainframe box is not high. In order to solve the technical problem, the invention provides a water-cooled computer mainframe box. The water-cooled computer mainframe box includes a box body, a main driving mechanism is fixedly connected to the top of the inner wall of the box body, a plurality of air holes and a plurality of air inlets are formed in the two sides of the box body respectively, a turbulent flow ventilation device is fixedly connected to the position, corresponding to the air holes, of one side of the inner wall of the box body, and theoutput end of the main driving mechanism is movably connected with the input end of the turbulent flow ventilation device. According to the technical scheme, in the starting process of the turbulencedevice, hot air flow in the mainframe box can be pumped out and disturbed, so that the air flow flows disorderly, the air flow can spread to all corners in the mainframe box, and the hot air flow in the mainframe box can be rapidly discharged.

Description

[0001] This application is a divisional application of a water-cooled computer main chassis with a turbulent flow two-way ventilation with an application date of June 28, 2018 and an application number of CN201810686467.4. technical field [0002] The invention relates to the technical field of computers, in particular to a water-cooled computer main chassis and a cooling method thereof. Background technique [0003] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. The core part of the desktop computer is the main chassis. [0004] For example, CN107885292A proposes a computer mainframe chassis, which mainly solves the problem that the computer will generate heat during the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20G06F2200/201
Inventor 崔永平
Owner 崔永平
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