Multilayer interconnection FPC with rapid tin guide via hole

Abstract

The invention discloses and provides a multilayer interconnection FPC with a rapid tin guide via hole, which is simple in structure, high in material utilization rate, capable of rapidly fusing enoughsoldering tin during welding and stable in performance. The FPC comprises a main FPC and an auxiliary FPC, the main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area; a main output bonding pad is arranged in the main output area, a main input bonding pad is arranged in the main input area, anauxiliary output bonding pad is arranged in the auxiliary output area, an auxiliary input bonding pad is arranged in the auxiliary input area, and tin guide via holes are formed in the auxiliary output bonding pad and the auxiliary input bonding pad; each of the main output bonding pad and the main input bonding pad is provided with at least one exhaust hole; a metal layer is plated in the tin guide via hole, and the metal layer of the tin guide via hole on the auxiliary input bonding pad is connected with the auxiliary input bonding pad; soldering tin is fused into the tin guide via hole, andthe main input bonding pad and the auxiliary output bonding pad communicate through the soldering tin. The multilayer interconnection FPC is applied to the technical field of FPC production.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a multi-layer interconnected flexible circuit board (FPC) with fast tin-conducting via holes. Background technique [0002] Multi-layer board FPC has multi-layer wiring layers, and an insulating layer is provided between two adjacent wiring layers. Multi-layer circuit boards generally have at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized Within an insulating board, the electrical connections between them are usually made through plated through-holes in the cross-section of the board. For some multi-layer FPCs, the number of traces in a certain conductive layer is small, resulting in a small actual use area of ​​this layer, low material utilization rate, and great material waste. For this reason, we have developed a multi-layer interconnected FPC composed of a main FPC large board and multiple auxiliar...

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Problems solved by technology

Due to the limited area design of the circuit board, the size of the pads of the main FPC and the auxiliary FPC is limited. To ensure good contact between the main FPC and the auxiliary FPC, it is necessary to ensure that the main FPC and the auxiliary FPC are under the limited pad area. There is a sufficient amount of solder between the pads of the FPC and the auxiliary FPC, but the problem of how to quickly melt enough solder between the pads of the main FPC and the auxiliary FPC is not well obtained in the prior art the solution

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