Heat conduction invisible method, device, and application

Abstract

The invention discloses a heat conduction invisible method, device and an application. A directional heat conduction structure composed of staggered high thermal conductivity materials and low thermalconductivity materials is introduced into a background heat conduction medium plane, one or more temperature field invisible areas are arranged in the directional heat conduction structure, the temperature field invisible areas are used for placing objects to be conducted invisible, the directional heat conduction structure can make directional guidance to an external temperature field so as to make the heat flow smoothly bypass the temperature field invisible areas, and the distribution gradient of temperature field in the temperature field invisible areas is zero, so that the heat conduction invisibility is realized. The heat conduction invisible method, device and the application can be used for the protection of electronic components on the surface of a printed circuit board, the guidance of thermal flow on the surface of a thermal solar cell, and the thermal shielding of artificial skin surface components. The heat conduction invisible method, device and the application is easy to realize, and the geometric shape can be arbitrarily designed and is not limited to a circular structure.

Description

technical field [0001] The invention belongs to a novel heat conduction cloaking technology, and in particular relates to a heat conduction cloaking method, device and application. Background technique [0002] Thermal conduction cloaking is a new type of thermal device proposed with the development of thermal metamaterials. When heat conducts on a uniform heat conduction plane, the distribution of the temperature field is also uniform. However, if there are some other objects with different thermal conductivity on the heat conduction plane, the distribution of the temperature field will no longer be uniform. At this time, outside observers will "perceive" the existence of other objects on the heat conduction plane through the temperature field distribution. The role of the thermal conduction invisible structure is to add a special thermal conductivity distribution structure around these objects whose thermal conductivity is different from the background thermal conductivit...

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Problems solved by technology

[0004] In order to solve the problems that the existing heat conduction cloaking structures require complex materials or the material thermal conductivity is related to the geometric size of the device, and the current heat conduction cloaking structures are only limited to the shape of a ring, the purpose of the present invention is to provide a heat conduction cloaking method, Devices and Applications

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