A high -resistant UV ink dual -layer layer -made printer protection device

A protection device and printing endurance technology, applied in printing, printing presses, rotary printing presses, etc., can solve the problems of poor shock absorption performance of the impression cylinder protection device, affecting the disassembly and assembly of the impression cylinder, etc., to facilitate automatic adjustment, Simple structure and easy assembly

Active Publication Date: 2021-07-13
浙江旗创科技集团有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide an impression cylinder protection device for a double-layer plate with high printing force and UV ink resistance, so as to solve the problem that the existing impression cylinder protection device proposed in the above background technology affects the disassembly and assembly of the impression cylinder. The problem of poor shock absorption performance of the impression cylinder protection device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high -resistant UV ink dual -layer layer -made printer protection device
  • A high -resistant UV ink dual -layer layer -made printer protection device
  • A high -resistant UV ink dual -layer layer -made printer protection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0035] In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear" ", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orien...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an embossing cylinder protection device for a double-layer plate material with high printing force and UV ink resistance, and relates to the technical field of offset printing plate machines. The printing cylinder, one end inside the impression cylinder is provided with a first rotating shaft, the other end inside the impression cylinder is provided with a second rotating shaft, the outside of the first rotating shaft and the second rotating shaft are both sleeved with a mounting ring, and the bottom of the mounting ring is provided with Adjusting seat, the middle part of the base is provided with a limit slot, and a support rod is movably connected in the limit slot, and the bottom end of the support rod is fixedly connected with a limit block. The top end of the support rod penetrates the base and is fixedly connected with the protective plate. The socket has a first spring. The present invention can play the role of shock absorption and buffering when the impression cylinder falls through the cooperative arrangement of the protective plate, the limit groove, the support rod, the limit block and the first spring, so as to avoid the impact of the impression cylinder The impression cylinder acts as a protection.

Description

technical field [0001] The invention relates to the technical field of offset printing plate machines, in particular to an embossing cylinder protection device for double-layer plates with high printing force and UV ink resistance. Background technique [0002] CTCP plate is the English abbreviation of Computer To Conventional Plate, which refers to computer direct plate making on the traditional PS plate, as a form of CTP plate process, in fact, CTCP plate is not the next best thing for CTP plate solution, but to complete computer-to-plate and derived another new way. As early as at the drupa1995 International Printing Exposition, Germany Bisheng Graphic Arts Co., Ltd. launched the UV-Setter plate-making machine that has taken shape, demonstrating the new technology of exposing traditional PS offset printing plates using UV light sources. This can be regarded as the first year of the birth of CTCP plates, and it was also at this drupa exhibition that CTP plate technology m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B41F13/18B41F13/20B41F13/34
CPCB41F13/18B41F13/20B41F13/34
Inventor 石甜乐张永涛陶笃全江云峰
Owner 浙江旗创科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap