Solid flooring base plate and base plate assembly

Abstract

The invention discloses a solid flooring base plate and a base plate assembly. The solid flooring base plate comprises a first mounting plate, and the first mounting plate comprises a first mounting face and first side faces; a second mounting plate comprises a second mounting face and second side faces; the plurality of first side faces and the plurality of second side faces are arranged in a one-to-one correspondence manner; first grooves are formed in the first side faces; second grooves are formed in the second side faces. The base plate assembly comprises an outer frame and a solid flooring base plate. The solid flooring base plate is arranged in the outer frame; the outer frame comprises inner side faces, the inner side faces are arranged corresponding to the first side faces, firstinserting strips are arranged on the inner side faces, second inserting strips are arranged on the inner side faces, the first inserting strips are installed in the first grooves and the second inserting strips are installed in the second grooves. According to the solid flooring base plate and the base plate assembly, the connection strength between the solid flooring base plate and the outer frame is improved, the construction progress is accelerated, the pavement quality of the floor is improved, the difficulty of later maintenance of the floor is reduced, and the user experience is improved.

Description

Technical field [0001] The invention relates to the technical field of architectural decoration, in particular to a paving substrate and a substrate assembly. Background technique [0002] In the interior decoration technology, the ground laid by the traditional floor paving method can give users a "safe and reliable" experience, which is widely recognized. [0003] In the prior art, in the process of laying the ground, the ground substrate, adhesive, and decorative layer (such as ceramic tiles, stone, etc.) are generally bonded in sequence to obtain a composite board assembly for laying the ground. Among them, the ground substrate is bonded and connected by the paving substrate and the outer frame. In the process of realizing the invention, the inventor found that the above-mentioned connection between the built-in substrate and the outer frame has the following shortcomings: first, the built-in substrate only adheres to the inner surface of the outer frame through its outer surf...

AI Technical Summary

Problems solved by technology

In the process of realizing the invention, the inventors found that the above-mentioned connection method between the solid paved substrate and the outer frame has the following disadvantages: first, the solid paved substrate is only bonded to the inner surface of the outer frame through its own outer surface, and the bonding area Small, weak composite strength, there is a risk of falling off the solid paved substrate and the outer frame, delaying the construction progress, and affecting the laying quality of the ground; second, the adhesive between the solid paved substrate and the outer frame will age over time , the bonding performance is gradually reduced, and the composite board is prone to the problem of increased gaps at the joints, which is not conducive to the later maintenance of the ground and reduces the user experience

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