Magnetic attraction type anti-reverse connection modular design of Internet of Things equipment using I2C protocol for communication

Abstract

The invention discloses a magnetic attraction type anti-reverse connection modular design of Internet of Things equipment using an I2C protocol for communication. The magnetic attraction type anti-reverse connection modular design comprises small magnets, a module top surface, a module bottom surface, an SCL lead wire, an SDA lead wire, a VCC lead wire, a GND lead wire, lead wires connecting electronic devices in a module, a module casing and circular holes. The magnetic attraction type anti-reverse connection modular design is characterized in that: the small magnets are fixed on the module top surface and the module bottom surface by means of the circular holes in the module top surface and the module bottom surface, N pole orientations and S pole orientations of the small magnets are specially designed, the small magnets on corresponding positions of the module top surface and the module bottom surface are connected by means of the lead wires, the lead wires comprise SCL and SDA lead wires responsible for communication as well as VCC and GND lead wires responsible for power supply, and the small magnets on the module bottom surface are further connected with the electronic devices inside the module by means of the lead wires so as to supply power and transmit data to the devices. The magnetic attraction type anti-reverse connection modular design solves the problem that misconnection is prone to occur among the SCL, SDA, VCC and GND lead wires when a plurality of sets of intelligent equipment using the I2C protocol for communication are connected with one another, avoidsthe occurrence of reverse connection between output ends and input ends of the two adjacent modules, prevents misoperation, improves the working efficiency, and is simple, practical, convenient and feasible.

Description

technical field [0001] The invention relates to Internet of Things devices including smart homes, in particular to a magnetic suction anti-reverse connection modular design for Internet of Things devices using I2C protocol communication. Background technique [0002] In IoT devices, various electronic devices such as temperature sensors, light sensors, and infrared emitters are often used. The design scheme of integrating electronic devices with different functions in one module is convenient for data exchange and communication, but when the situation changes , When it is necessary to add new electronic devices to achieve more functions, the disadvantages of fixed functions and inability to expand in this integrated design scheme will appear. In order to solve the problem of function expansion, electronic devices with different functions can be designed into modules with the same appearance and different functions, and then connect multiple modules, add or reduce modules acc...

AI Technical Summary

Problems solved by technology

If you connect the four kinds of wires one by one according to the usual plug-in method, it is cumbersome and prone to misconnection, which will cause the system to fail to work normally, and even cause damage to electronic devices.

Images