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Butterfly wing microgyroscope using polygonal vibration beam and preparation method thereof

A vibrating beam and polygonal technology, which is applied in the direction of gyroscope/steering sensing equipment, gyro effect for speed measurement, measuring device, etc., can solve the problem of high degree of influence of the azimuth angle of the main axis of the section, weak section tolerance ability, and difficult control of machining errors To achieve good stress release effect, improve structural robustness, and reduce structural stress

Active Publication Date: 2019-04-05
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The second is that the convex beam section is easily affected by machining errors, the size deviation has a high degree of influence on the azimuth of the main axis of the section, the section tolerance is not strong, the machining error is difficult to control, and the machining is difficult

Method used

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  • Butterfly wing microgyroscope using polygonal vibration beam and preparation method thereof
  • Butterfly wing microgyroscope using polygonal vibration beam and preparation method thereof
  • Butterfly wing microgyroscope using polygonal vibration beam and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0050] Such as figure 2 with image 3 As shown, the present embodiment adopts the butterfly-wing micro-gyroscope with polygonal vibrating beams to include a silicon electrode substrate 1, a silicon cover plate 3, and a silicon sensitive structure 2 with a vibrating beam. The vibrating beam of the silicon sensitive structure 2 is used to prepare the silicon sensitive The SOI silicon wafer of structure 2 is a polygonal vibrating beam 22 made of wet etching and dry etching as raw materials, and the azimuth angle of the main axis of the polygonal vibrating beam 22 is not equal to 90°. In the silicon sensitive structure 2 of the butterfly-wing micro-gyroscope, the vibration beam is an important part of the silicon sensitive structure 2. The stiffness of the vibration beam determines the driving and detection modal frequency and the motion characteristics of the vibration beam, and the stiffness of the vibration beam is related to the vibration beam The cross-sectional shape is cl...

Embodiment 2

[0079] This embodiment is basically the same as the first embodiment, the main difference being that the shape of the polygonal vibrating beam 22 is different. Such as Figure 12 As shown, the cross-section of the polygonal vibrating beam 22 in this embodiment is pentagonal, and one end of one side (a side) of the polygonal vibrating beam 22 is respectively provided with an inclined wall a formed by wet etching. 1 , Both ends of the other side (side b) are straight walls b formed by dry etching 1 and b 2 , the other end of side a is a straight wall a formed by dry etching 2 .

Embodiment 3

[0081] This embodiment is basically the same as the first embodiment, the main difference being that the shape of the polygonal vibrating beam 22 is different. Such as Figure 13 As shown, the cross-section of the polygonal vibrating beam 22 in this embodiment is a quadrilateral, the width of one side (side a) of the polygonal vibrating beam 22 is 0, and one end of the side a is respectively provided with a bevel formed by wet etching. wall a 1 , Both ends of the other side (side b) are straight walls b formed by dry etching 1 and b 2 , the other end of side a is a straight wall a formed by dry etching 2 .

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Abstract

The invention discloses a butterfly wing microgyroscope using a polygonal vibration beam and a preparation method thereof. The butterfly wing microgyroscope comprises a silicon electrode substrate, asilicon cover plate and a silicon sensitive structure with the vibration beam, and the vibration beam of the silicon sensitive structure is the polygonal vibration beam prepared by combining wet etching and dry etching using a SOI silicon wafer for preparing the silicon sensitive structure as a raw material, and the principal axis azimuth of the polygonal vibration beam is not equal to 90 degrees.The preparation method comprises the steps that the SOI wafer is used the raw material, and the butterfly wing microgyroscope is prepared by combining wet etching and dry etching. The flexible configuration of the principal axis azimuth of the microgyroscope can be achieved, and meanwhile the effect of reducing the machining technic error on the performance of the microgyroscope is reduced, and the butterfly wing microgyroscope has the advantages of high tolerance capability, simple machining technic, high machining quality, good machining robustness, good stability and wide range of application.

Description

technical field [0001] The invention relates to a silicon micro sensor and its silicon micro gyroscope technology, in particular to a butterfly-wing micro gyroscope using a polygonal vibrating beam and a preparation method thereof. Background technique [0002] The gyroscope is a sensor that measures the rotational motion of the carrier relative to the inertial space. It is the core device in the fields of motion measurement, inertial navigation, guidance and control, etc. It plays a very important role in high-end industrial equipment and precision strike weapons such as aerospace, intelligent robots, and guided munitions. Value. MEMS gyroscopes mainly include mechanical rotor gyroscopes, electrostatic gyroscopes, laser gyroscopes, fiber optic gyroscopes, and micro-electromechanical gyroscopes. Mechanical rotor gyros and electrostatic gyros have the highest accuracy, but are very expensive and take a long time to start. Laser gyroscopes and fiber optic gyroscopes can reac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/5656G01C19/5663
CPCG01C19/5656G01C19/5663
Inventor 肖定邦吴学忠侯占强欧芬兰
Owner NAT UNIV OF DEFENSE TECH
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