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A data information input method and system based on Via Wizard software

A technology of data information and software, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as PCB file identification, affecting PCB high-speed performance, simulation overthrow and repeat, etc., to reduce error rate and input quickly , the effect of improving work efficiency

Active Publication Date: 2019-04-02
上海泽丰半导体科技有限公司
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Problems solved by technology

However, usually a large part of the PCB files designed by the design software cannot be directly recognized by the ANSYS software. At this time, we need to use the Via wizard, the via modeling wizard, to make the model.
[0003] When using Via Wizard to build a via model of a complex stack, we will find that we need to manually input too

Method used

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  • A data information input method and system based on Via Wizard software
  • A data information input method and system based on Via Wizard software
  • A data information input method and system based on Via Wizard software

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Embodiment Construction

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0030] In order to make the drawing concise, the parts related to the present invention are only schematically shown in each drawing, and they do not represent the actual structure of the product.

[0031] The present invention provides an embodiment of a data information input method based on Via Wizard software, refer to figure 1 shown; includes:

[0032] Step S100 obtains the laminated information table of the printed circuit board;

[0033] Step S200 classifying and sorting ...

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Abstract

The invention discloses a data information input method based on Via Wizard software. The method comprises the following steps: obtaining a laminated information table of a printed circuit board; classifying and arranging all the laminated layers in the laminated layer information table; extracting preset parameter information from the laminated information table which is classified and arranged,wherein the preset parameter information comprises a via hole parameter; and converting the extracted via hole parameters into a file in a preset format, and inputting the converted via hole parameters of the file in the preset format into Via Wizard software. Format conversion is carried out on a lamination impedance calculation table and is converted into a unified format, so that on one hand, the error rate of data is reduced for simulation work of an engineer; on the other hand, input is faster, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the field of PCB design, in particular to a data information entry method and system based on Via Wizard software. Background technique [0002] When SI engineers model PCB vias, they usually use the method of directly importing PCB files into Ansys software, but this method is based on the fact that ANSYS software can correctly identify PCB files. However, usually a large part of the PCB files designed by the design software cannot be directly recognized by the ANSYS software. At this time, we need to use the Via wizard, the via modeling wizard, to make the model. [0003] When using Via Wizard to build a via model of a complex stack, we will find that we need to manually input too much data such as stack, via information, hole arrangement information, etc. to complete the establishment of the via model. In the case of a large amount of data It is extremely prone to data entry errors, which may cause the simulation to be over...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/367G06F30/39
Inventor 邱碧辉罗雄科
Owner 上海泽丰半导体科技有限公司
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