Low-cost multi-layer damping packaging structure

A packaging structure and low-cost technology, applied in the packaging field, can solve the problems of non-reusable, poor shock-absorbing and protective functions of packaging bags, etc., and achieve the effects of protecting the environment, reducing waste emissions, and reducing costs

Inactive Publication Date: 2019-03-29
BETA SHENZHEN PACKAGE PRODS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-cost multi-layer shock-absorbing packaging structure, which aims to solve the technical problems that the existing packaging bags have poor shock-absorbing protection functions and cannot be reused

Method used

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  • Low-cost multi-layer damping packaging structure
  • Low-cost multi-layer damping packaging structure
  • Low-cost multi-layer damping packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Below in conjunction with specific embodiment and accompanying drawing, the present invention is further elaborated and illustrated:

[0024] Please refer to Figure 1-4 The figure shows a low-cost multi-layer shock-absorbing packaging structure of the present invention, including a packaging bag body 11, the packaging bag body 11 is composed of a bag body 2 and a sealing tongue 3, and an adhesive sticker 4 is pasted on the sealing tongue 3;

[0025] The inner wall of the bag body 2 is pasted with a shock-absorbing layer 5;

[0026] The low-cost multi-layer shock-absorbing packaging structure also includes: a fixing structure jointly formed on the bag body 2 and the sealing tongue 3, and the fixing structure is used to seal the sealing tongue 3 on the On bag body 2.

[0027] Preferably, the shock absorbing layer 5 is one of corrugated paper, sponge, cotton products and feather products.

[0028] Preferably, a sponge 11 is placed between the shock-absorbing layer 5 an...

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PUM

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Abstract

The invention discloses a low-cost multi-layer damping packaging structure. The low-cost multi-layer damping packaging structure comprises a packaging bag body, the packaging bag body is composed of abag body and a sealing tongue, and a glue sticker is attached to the sealing tongue; a damping layer is adhered to the inner wall of the bag body; and a fixing structure comprising two parts which are located on the bag body and the sealing tongue respectively is used for sealing the sealing tongue and the bag body. According to the technical scheme, the shock absorption protection performance ofthe packaging bag can be enhanced, the cost can be reduced by repeated use of the packaging bag multiple times, the waste discharge can be reduced and the environment can be protected.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a low-cost multi-layer shock-absorbing packaging structure. Background technique [0002] With the rapid development of the logistics industry in today's society, there are all kinds of packaging bags. As a packaging bag, the most important and basic function is to protect the internal items from damage. However, most of the packaging bags on the market are ordinary paper boxes and plastic bags. Such packaging bags cannot achieve the effect of protection, but only wrap the items. Although there are plastic protective bags with air bubbles, once the air bubbles are punctured, they will be damaged. Lost the function of protection, and these products are disposable consumer goods, not only the cost is high, but also produce too much packaging waste to pollute the environment. A low-cost multi-layer shock-absorbing packaging structure can not only enhance the shock-absorbing prote...

Claims

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Application Information

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IPC IPC(8): B65D33/24B65D33/00B65D81/03
CPCB65D33/00B65D33/243B65D81/03
Inventor 阎金伟
Owner BETA SHENZHEN PACKAGE PRODS
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