A kind of super barrier diode device
A technology of super-barrier diodes and devices, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of poor reverse blocking ability and low forward current density, so as to improve rectification efficiency and voltage blocking. ability, the effect of increasing the forward current level
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Embodiment 1
[0071] In this embodiment, the structure of a 1200V super-barrier diode device is taken as an example. The body material is silicon carbide, and the schematic diagram of its cell is as follows figure 2 shown. Including cathode metal 9, N+ silicon carbide substrate 8 and N- silicon carbide drift region 7 arranged in sequence from bottom to top, a P-type silicon carbide base region 6 is set on the left side of the top layer of the N- silicon carbide drift region 7, and a P-type silicon carbide The left side of the top layer of the base region 6 is arranged side by side from left to right in close contact with the P+ silicon carbide contact region 5 and the N+ silicon carbide source region 4, and the depth of the N+ silicon carbide source region 4 does not exceed the depth of the P+ silicon carbide contact region 5; The upper surface of the right side of the silicon carbide source region 4, the upper surface of the P-type silicon carbide base region 6 on the right side of the N+...
Embodiment 2
[0074] This embodiment makes a certain degree of modification to embodiment 1, and its structure is roughly the same as embodiment 1, the difference is that there is also an anode metal 1 inside the groove structure, that is, the depth of the bottom of the anode metal 1 is deeper than that of the groove at the top of the structure, such as Figure 8 shown. This improvement can reduce the gate resistance, increase the charging speed of the gate charge, and further optimize the rectification performance of the device, so that the gate control capability of the device is further improved.
Embodiment 3
[0076] This embodiment makes some modifications to Embodiment 1 and Embodiment 2, and its structure is roughly the same as that of Embodiment 2, the difference is that the N-SiC drift region 7 on the right side of the P-type SiC The right side of the surface does not have a layer of dielectric layer 3, the dielectric layer 3 is replaced by polysilicon 2, polysilicon 2 and N-silicon carbide drift region 7 form a Si / SiC heterojunction, the junction width is about 0.1 μm ~ 0.4 μm ,Such as Figure 9 shown. The super-barrier diode in this embodiment has a three-dimensional super-barrier structure and a Si / SiC heterojunction, which increases the number of sub-current branches in the on-state of the device, and improves the performance of the diode in this embodiment again. Forward conduction current level.
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