Electronic package and its manufacturing method

Abstract

An electronic package and its manufacturing method are used to arrange electronic components and an antenna structure on a carrier, wherein the antenna structure includes a metal frame erected on the carrier, and a connection between the metal frame and the carrier The antenna extension part between them, and the wire that is arranged on the carrier and electrically connects the metal frame and the antenna extension part, so as to use the antenna extension part as an increase in the area of ​​the layout area, and thus does not need to be placed on the surface of the carrier part By increasing the layout area, the length of the antenna structure can be increased to meet the requirements of the antenna operation.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. characteristics and are widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDA). [0003] figure 1 It is a three-dimensional s...

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Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the manufacturing process, the The antenna body 120 is difficult to integrate with the electronic component 11, that is, the packaging material 13 only covers the electronic component 11, but not the antenna body 120, so that the mold for the packaging process needs to correspond to the layout area of ​​these electronic components 11, and Does not correspond to the size of the substrate 10, which is not conducive to the packaging process

[0005] In addition, because the antenna structure 12 is planar, when the length of the antenna structure 12 needs to be increased, it is necessary to increase the layout area (the area where the packaging material 13 is not formed) on the surface of the substrate 10 to form the antenna body 120, However, the length and width of the substrate 10 are fixed, so it is difficult to increase the area of ​​the layout area, so that the length of the antenna structure 12 cannot be increased, and thus the requirements for antenna operation cannot be met.

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