Computer mainframe with good heat dissipation performance

A heat dissipation performance, computer technology, applied in computing, instruments, electrical digital data processing, etc., can solve problems such as poor heat dissipation, troublesome disassembly of the sealing plate of the mainframe chassis, poor dustproof performance, etc., to increase convenience and reduce disassembly difficulty , The effect of easy disassembly

Pending Publication Date: 2018-10-30
伍丽萍
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a computer mainframe with good heat dissipation performance to solve the problems of poor heat dissipa

Method used

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  • Computer mainframe with good heat dissipation performance
  • Computer mainframe with good heat dissipation performance
  • Computer mainframe with good heat dissipation performance

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-5 , an embodiment provided by the present invention: a computer mainframe with good heat dissipation performance, including a chassis 1, a water-cooled heat dissipation device 3, a volume control insert 8 and a sealing plate 14, and a mainframe body 2 is installed at the inner bottom of the chassis 1, And the left side of the host main body 2 is fixedly connected with a water-cooling heat dissipation device 3 .

[0023] Preferably, the wa...

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Abstract

The invention discloses a computer mainframe with good heat dissipation performance. The computer mainframe comprises a case, a water-cooling heat dissipation device, a control insertion sheet and a sealing plate, wherein a mainframe body is installed at the bottom end inside the case, the water-cooling heat dissipation device is fixedly connected to the left side of the mainframe body, a fan is fixed to the left wall inside the case, a positive plate and a negative plate are sequentially installed from top to bottom on the back inside the case, the control insertion sheet is arranged inside aheat dissipation net, the sealing plate is embedded into the top end of a fixed embedding sleeve, a fixed rod is installed at the left side of the front of the case, a fixed sheet is fixedly connected to the top end of the front of the case, and an extrusion plate is connected to the front of the fixed sheet in a sleeving mode. According to the computer mainframe, the water-cooling heat dissipation device and the fan are arranged and cooperate with each other in use, so that the heat dissipation effect is enhanced, the dust prevention performance of the mainframe is enhanced, the operating speed of the mainframe is guaranteed, it is convenient to dismantle the fixed rod, repair difficulty is lowered, and maintenance speed is increased.

Description

technical field [0001] The invention relates to the technical field of computer equipment, in particular to a computer mainframe with good heat dissipation performance. Background technique [0002] With the continuous development of science, the continuous progress of society, and the continuous improvement of the quality of life, the computer, as an important equipment in life, has become an indispensable tool. task. [0003] Traditional computers can be divided into mainframe and peripherals. The mainframe tends to generate a lot of heat when it is working. If the temperature is too high, it will affect the computing speed of the mainframe. The traditional mainframe has poor heat dissipation effect and poor dustproof performance. It is troublesome to disassemble the sealing plate of the host chassis, which increases the difficulty of maintenance and disassembly. Contents of the invention [0004] The object of the present invention is to provide a computer mainframe w...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20G06F2200/201
Inventor 巫立斌伍丽萍
Owner 伍丽萍
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