Reworking method for electroplated clamping membrane defective products

Abstract

The invention discloses a reworking method for electroplated clamping membrane defective products. The method comprises the steps that when pattern transferring is carried out after electroless plating copper of circuit boards or electroplating of the whole boards, unqualified boards on which pattern electroplating problems occur are checked out; film stripping treatment is carried out on the unqualified plates; the plasma degumming mode is adopted to remove glue remaining on the unqualified plates; oxidation layers on the surfaces of the unqualified plates are removed; etching is carried outto obtain line patterns in accordance with requirements; AOI inspection is carried out. The adopted plasma degumming mode can remove film residues clamped among lines, the etching quality is ensured,the scrap cost is reduced, the production efficiency of circuit board printing is improved, and after degumming is completed, the circuit boards are soaked in ammonium hydroxide or washed with the ammonium hydroxide to remove the surface oxidation layers, therefore it is ensured that tin coating layers cannot be corroded. The method thoroughly solves the problem that electroplated clamping membranes cause scrapping due to abnormal quality, the reworking quality is improved, abnormal scrapping is reduced, the working procedure plan achieving rate is improved, the scrap cost caused by abnormityis reduced, the working procedure supplementing rate is reduced, and the comprehensive competitive power of enterprises is improved.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for reworking defective products of electroplating sandwich film. Background technique [0002] With the continuous development of electronic products towards light, thin, short and small high-density integration, higher and stricter requirements are put forward for PCB manufacturing. As a manufacturing process, graphic electroplating is an important process for thickening the circuit layer and hole plating after external light imaging. Due to improper operation of personnel, failure of electroplating equipment, customer design and other problems, there will inevitably be problems with the quality of the electroplating film. At that time, after the problem occurred, because it could not be reworked, most enterprises dealt with it by scrapping. If it is a multi-layer board, the scrapping due to the abnormal quality of the outer layer circuit will cause greater...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problems existing in the prior art, the present invention provides a rework method for defective products of electroplating cladding. During the inspection, after abnormal quality is found, the problematic board is reworked, so that the product meets the customer's quality requirements and reduces the loss of scrapping

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