A connection probe, its preparation method and use in microelectrode array connection

A technology for connecting probes and connecting columns, which is applied in the directions of electrodes, internal electrodes, and head electrodes, etc., which can solve the problems of affecting the performance and life of the microelectrode array, damaging the welding end of the microelectrode array, increasing the difficulty and cost of production, etc. Achieve the effect of reversible connection mode, good universality and wide range

Active Publication Date: 2021-12-28
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of probe card generally needs to be customized, and when it acts on a high-density microelectrode array, the size of the probe card will become very small, which greatly increases the difficulty and cost of production, and the price is very expensive. The probe of the probe card is generally made of hard material. When it is used to test the flexible high-density microelectrode array, it may damage the welding end of the microelectrode array and affect the performance and life of the microelectrode array.

Method used

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  • A connection probe, its preparation method and use in microelectrode array connection

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Embodiment 1

[0073] This embodiment provides a ligation probe and a preparation method thereof, the method comprising:

[0074] (1) Prepare the substrate: select a glass sheet with better dielectric properties as the substrate, and use it after cleaning (see figure 1 1-a) in.

[0075] (2) Exposure and development: Spin-coat a layer of photoresist AZ5214 on the substrate with a thickness of 3-5 microns. After heating and curing, use the first layer of mask as a mask for exposure and development (see figure 1 1-b) in.

[0076] (3) Metal deposition and metallic glass: the metal coating process is carried out on the sample after photolithography, and the Cr / Au metal layer of 20nm / 100nm is completed, and the target metal pattern is obtained by lift-off (see figure 1 1-c and 1-d in )

[0077] (4) Spin-coat light-thick photoresist, exposure and development, and electroplating metal: Next, spin-coat AZ4620 photoresist of 7-8 microns, expose and develop the metal of the probe part, and use the t...

Embodiment 2

[0082] Except not carrying out step (5) the step of spin-coating SU-8, other methods and conditions are identical with embodiment 1.

Embodiment 3

[0084] This embodiment provides a ligation probe and a preparation method thereof, the method comprising:

[0085] (1) Spin-coat AZ5214 photoresist with a thickness of 3 μm on the substrate, heat and cure it, then use a mask for exposure and development, and then deposit a 20nm Cr layer and a 100nm Au layer on the entire substrate area successively. This 120nm thick composite layer As a metal seed layer, the photoresist is stripped to form a metal seed layer arranged at intervals on the substrate;

[0086](2) Spin-coat AZ4620 photoresist on the entire substrate area, then expose the metal seed layer by exposure and development, use the photoresist as a mask, and electroplate on the metal seed layer to obtain a 7 μm thick metal coating, the metal seed layer and The metal plating layers jointly form array units arranged at intervals;

[0087] Wherein, the thickness of the AZ4620 photoresist is 7 μm to 8 μm, which is the same as the thickness of the array unit;

[0088] (2)'Spi...

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Abstract

The invention discloses a connection probe, its preparation method and its application in the connection of micro-electrode arrays. It belongs to the technical field of microelectrode arrays. The connection probe of the present invention includes a base and array units arranged at intervals on the base, and the array units include a metal seed layer and a metal plating layer from bottom to top. The invention utilizes traditional MEMS technology and innovative design to solve the problem that the high-density micro-electrode array is difficult to conduct electrical test and reliability test, or the micro-electrode array will be damaged during the test process. Utilizing the characteristics of high precision and miniaturization of MEMS processing and preparation, probes for high-density flexible microelectrode testing can be prepared, which can achieve non-destructive testing effects. Moreover, the connection probes of the present invention are reversible, and can be removed and repeated after the test is completed. use.

Description

technical field [0001] The invention belongs to the technical fields of microelectrode array technology, microelectromechanical system and implanted neural interface, and relates to a connection probe, its preparation method and its application in microelectrode array connection, especially to a connection probe, its preparation Method and use in connection of implantable flexible neurostimulation electrodes. Background technique [0002] Generally, the flexible microelectrode array is composed of stimulation points, wires, and pads. The finished flexible microelectrode array needs to be electroplated or electrically tested, so that the flexible microelectrode array must be connected to external electrical equipment, such as electroplating. ChemStation, electrical testing requires connection to test circuit. [0003] In order to establish a connection between the flexible microelectrode array and external electrical equipment, the general method is to solder the electrode t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61N1/36A61N1/05
CPCA61N1/0543A61N1/36046A61N1/36125
Inventor 孙滨吴天准夏凯付博文
Owner SHENZHEN INST OF ADVANCED TECH
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