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Wafer centering device for measurement apparatus

A technology of centering device and measuring instrument, which is applied in the direction of grinding device, semiconductor/solid-state device testing/measurement, large-scale fixed member, etc., which can solve the problem of high error rate of measuring instrument, frequent wafer centering error, and reduced operation rate of CMP equipment, etc. problem, to solve the centering error and improve the operation rate.

Inactive Publication Date: 2018-04-17
科麦特有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the error rate of the measuring instrument is high due to frequent centering errors of the wafer inserted into the measuring instrument
This problem caused a problem that the operation rate of the CMP equipment at the front end of the measuring instrument decreased.

Method used

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  • Wafer centering device for measurement apparatus
  • Wafer centering device for measurement apparatus
  • Wafer centering device for measurement apparatus

Examples

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Embodiment Construction

[0026] A wafer centering device for a measuring instrument according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this specification, the same and similar reference signs are attached|subjected to the same and similar structure.

[0027] figure 1 It is a perspective view showing a state in which a wafer W is supported by the wafer centering device 100 for a measuring instrument according to an embodiment of the present invention.

[0028] Referring to the drawings, the wafer centering apparatus 100 may have a body unit 110 , a guide unit 130 and a shift unit 150 .

[0029] The body unit 110 is installed on the CMP equipment. A guide unit 130 and a displacement unit 150 are provided on the body unit 110 .

[0030] The guide unit 130 supports the wafer W, and guides the operation of the shift unit 150 . Specifically, the guide unit 130 may have a support part 131 , a mounting part 133 and a thr...

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PUM

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Abstract

The present invention provides a wafer centering device for a measurement apparatus, the device comprising: a body unit; a guide unit which is installed in the body unit, has a support part for supporting a wafer, and has a through-hole and; and a displacement unit which is formed to be moved in the through-hole and has a pusher for moving the wafer on the support part.

Description

technical field [0001] The invention relates to a device for centering a wafer in a measuring instrument for measuring the thickness of the wafer. Background technique [0002] In general, CMP (Chemical Mechanical Polishing) is a process of reducing and leveling the wiring steps of a wafer. [0003] Specifically, the CMP process is a method of forming a pad having a curvature on a platen, and attaching a CVD-processed wafer to a head device, thereby rotating the wafer while applying pressure to the wafer. [0004] After CMP, the wafer is polished by a thickness measurement instrument placed adjacent to the CMP apparatus. However, the error rate of the measuring instrument is high due to frequent centering errors of the wafer inserted into the measuring instrument. This problem leads to a problem that the operating rate of the CMP equipment at the front end of the measuring instrument decreases. Contents of the invention [0005] technical problem to be solved [0006] ...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/304H01L21/306H01L21/68H01L21/683H01L21/02
CPCH01L21/67253H01L21/68721H01L21/68B24B37/345B23Q1/56H01L21/30625
Inventor 李揆成郑惠锡权宁钟
Owner 科麦特有限公司
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