Substrate transfer chuck and substrate transfer method

Abstract

The invention discloses a clamp for transporting substrates, which includes a frame, a carrying assembly, a first blocking piece and a second blocking piece, the carrying assembly is fixed in the frame, and includes a first area and a second area for carrying two substrates respectively ; A row of linearly arranged first stoppers are respectively provided on the first side of the first area and the second area towards the frame, and a row of linearly arranged first stoppers are respectively provided on the side of the first area and the second area towards the second side of the frame. The second blocking member; the first side is arranged adjacent to the second side, and the bearing assembly is arranged obliquely. The invention also discloses a substrate conveying method. By using an inclined substrate placement method, two substrates are simultaneously carried by the inclined carrier assembly in the frame, the substrates are tilted towards one of the corners, and the two sides with the lowest height of the substrates are controlled by the first stopper and the second stopper The blocking limit ensures that the substrate will not shift during the handling process, and improves the position accuracy of the substrate and the production efficiency of the machine.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate transport clip and a substrate transport method. Background technique [0002] In the AMOLED (Active-matrix organic light emitting diode, active matrix organic light-emitting diode panel) process, the organic light-emitting material needs to be evaporated onto the Array (array) substrate through an evaporation machine. Due to the high price of the evaporation machine and the equipment Due to some limitations of its own characteristics, it is impossible to make larger substrates. [0003] The existing production method is usually to cut the whole substrate in half after the Array substrate is manufactured into two half-board substrates of half size each, and then enter the evaporation machine to complete the evaporation process. After the evaporation process of the half-cut substrate is completed, the two half-board substrates need to be spliced ​​together to complet...

AI Technical Summary

Problems solved by technology

After the evaporation process of the half-cut substrate is completed, the two half-board substrates need to be spliced ​​together to complete other subsequent processes. The reason is that the positions of the two substrates are easily shifted, and the contours of the two are no longer flush, which cannot meet the positional accuracy requirements of the subsequent process machines for the glass substrates. Manual correction of the position of the substrates is required, which affects the operations of the subsequent processes. efficiency

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