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Process kit having tall deposition ring and deposition ring clamp

A technology of deposition rings and accessories, applied in electrical components, vacuum evaporation plating, coatings, etc., can solve problems such as substrate cracking and substrate disposal problems

Pending Publication Date: 2018-03-09
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this point, deposits may stick or adhere to the back of the substrate, which can cause substrate handling issues and cause substrate cracking

Method used

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  • Process kit having tall deposition ring and deposition ring clamp
  • Process kit having tall deposition ring and deposition ring clamp
  • Process kit having tall deposition ring and deposition ring clamp

Examples

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Embodiment Construction

[0014] Embodiments of processing assemblies and processing chambers including such processing assemblies are provided herein. In some embodiments, provided herein is a process kit comprising a one-piece process kit shield and a high deposition ring. The high deposition ring advantageously allows for increased accumulation of deposition material on the high deposition ring compared to conventional deposition rings. As such, high deposition rings can go through more processing cycles before being cleaned because deposits do not adhere to the backside of the substrate being processed as quickly as conventional deposition rings. To further alleviate the problems associated with deposits adhering to the backside of the substrate, a clamping assembly may be provided to hold the high deposition ring in a low position if deposits on the high deposition ring were to adhere to the backside of the substrate. In this way, damage associated with lifting the substrate due to deposits adher...

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Abstract

Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate supportdesigned to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of theannular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depthbetween an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.

Description

technical field [0001] Embodiments of the present disclosure generally relate to substrate processing equipment. Background technique [0002] Process accessory shields may be used, for example, in physical vapor deposition (PVD) chambers to separate process spaces from non-process spaces. In a PVD chamber configured to deposit aluminum on a substrate, process fitting shields may be fabricated, for example, from stainless steel (SST). Since the aluminum layer deposited on the process kit shield can be etched away from the base SST shield material during processing, the SST process kit shield can be recycled multiple times. However, the present inventors have been working to deposit relatively thick aluminum films on substrates using significantly increased processing power and deposition time compared to conventional aluminum deposition processes. [0003] For high deposition processes, the buildup of deposits on the process kit is significant to the extent that the deposi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C14/34C23C14/56
CPCC23C14/3407C23C14/50C23C14/564H01J37/34H01J37/3488H01J37/32477C23C14/34
Inventor 威廉·约翰森希兰库玛·萨万戴亚阿道夫·米勒·艾伦王新帕拉沙特·帕布
Owner APPLIED MATERIALS INC
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