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A clamping device suitable for multi-substrate high-precision electroplating

A clamping device and high-precision technology, applied in the direction of electrolytic components, electrolytic process, etc., can solve the problems of poor electroplating uniformity, low work efficiency, and low universality of products, and achieve good electroplating uniformity of products, high production efficiency, low cost effect

Active Publication Date: 2019-02-26
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a device for clamping a plurality of substrates of the same size for high-precision electroplating to improve the complex structure and high cost of existing devices. , low universality, low work efficiency, poor plating uniformity of products, etc.

Method used

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  • A clamping device suitable for multi-substrate high-precision electroplating
  • A clamping device suitable for multi-substrate high-precision electroplating

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Embodiment Construction

[0024] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0025] Any feature disclosed in this specification, unless specifically stated, can be replaced by other alternative features that are equivalent or have similar purposes. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0026] The invention provides a clamping device suitable for multi-substrate high-precision electroplating such as figure 1 As shown, it includes a substrate cover plate 1-3-1, a substrate bottom plate 1-3-2, an anode positioning plate 1-6 and an auxiliary anode probe 1-5; on the substrate bottom plate 1-3-2 A plurality of rectangular cavities 1-2 are provided; rectangular through holes are opened on the substrate cover plate 1-3-1 corresponding to the rectangular cavities 1-2; the anode positioning ...

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Abstract

The invention discloses a clamping device suitable for multi-substrate high precision electroplating, relates to a device for clamping a plurality of different substrates for high precision electroplating, and aims to improve the problems that an existing device is complicated in structure, relatively high in cost, low in universality, low in work efficiency, relatively poor in electroplating uniformity of a product and the like. The technical key point is follows: the clamping device comprises a substrate cover (1-3-1), a substrate bottom plate (1-3-2), an anode positioning plate (1-6) and anauxiliary anode probe (1-5); a plurality of rectangular slots (1-2) are formed in the substrate bottom plate (1-3-2); rectangular through holes are formed in positions, corresponding to the rectangular slots (1-2), of the substrate cover (1-3-1); the anode positioning plate (1-6), the substrate cover (1-3-1) and the substrate bottom plate (1-3-2) are fixedly connected through fixed bolts (1-1); screw holes (1-4) are distributed in an array in the anode positioning plate (1-6); and the auxiliary anode probe (1-5) is arranged in a screw position in the anode positioning plate (1-6).

Description

technical field [0001] The invention relates to a clamping device, in particular to a device for clamping a plurality of substrates of the same size for high-precision electroplating. Background technique [0002] At present, in the field of electronic packaging technology, electroplating technology has developed into a very important modern processing technology. Electroplating is a surface treatment technology that uses the principle of electrodeposition to obtain a coating. In the electroplating process, the workpiece to be electroplated is used as the cathode, and the dissolved part of the metal to be deposited is used as the anode. Electroplating is a technique in which the cathode and anode are immersed in the electrolyte containing the metal ions to be deposited, and an electric current is applied to electrolytically deposit the metal ions on the surface of the workpiece. Due to the irregular surface shape of the workpiece, areas with high current density and areas w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/08
Inventor 李彦睿王春富秦跃利王春晖
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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