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TOP-class LED package of UV packaging glue and packaging process thereof

A technology of LED packaging and packaging glue

Pending Publication Date: 2017-11-03
HARVATEK OPTOELECTRONICS SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the existing encapsulation adhesives of TOP LEDs have the following disadvantages in the production process: the glue is generally made of a mixture of two glues, A and B, and needs to be proportioned according to the actual glue situation, and at the same time, it needs to be stirred and operated. It is more cumbersome, and at the same time, the error of the ratio is stricter, and the uniformity of the glue mixing is higher, which increases the difficulty of use; after the glue is dispensed, it needs to be baked for curing. The curing condition is 1-2h, and the production capacity is easily limited. Production higher cost

Method used

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  • TOP-class LED package of UV packaging glue and packaging process thereof
  • TOP-class LED package of UV packaging glue and packaging process thereof
  • TOP-class LED package of UV packaging glue and packaging process thereof

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Embodiment Construction

[0036] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0037] Please refer to the attached image 3 , image 3 It is a schematic diagram of the LED package structure 1 of the present invention. The LED package includes a substrate 5, an LED light-emitting part, and a lens 2. The dam glue 4 is arranged on the substrate 5. The LED light-emitting part is welded at the center of the substrate 5 and is located at the dam glue 4. Within, the dam glue 4 is filled with UV glue 3, the lens 2 is covered on the cured UV glue 3, the edge of the lens 2 and the inner wall of the dam glue 4 are sealed, and the lens 2 is a semicircle A lens, the surface of the lens is coated with a layer of anti-reflection coating ...

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Abstract

The invention discloses a TOP LED packaging with UV packaging glue and a packaging process thereof. The LED packaging includes a substrate, an LED light-emitting part, and a lens. The substrate is provided with dam glue, and the LED light-emitting part is welded at the center of the substrate. Located inside the dam glue, the dam glue is injected with UV glue, the lens is covered on the cured UV glue, the edge of the lens and the inner wall of the dam glue are sealed, and the surface of the lens is coated with a layer of AR coating. The packaging glue used in the LED packaging of the present invention adopts a new UV glue, and the glue is directly cured by UV, thereby replacing the traditional stirring and baking process.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation, in particular to a TOP-type LED encapsulation of UV encapsulation glue and an encapsulation process thereof. Background technique [0002] Most of the glue used for TOP LED packaging is a mixture of A and B glues. It needs to be stirred before use, and it needs to be baked for 1-2 hours after dispensing. Such as figure 1 As shown, the existing encapsulation adhesives of TOP LEDs have the following disadvantages in the production process: the glue is generally made of a mixture of two glues, A and B, and needs to be proportioned according to the actual glue situation. At the same time, it needs to be stirred and operated. It is more cumbersome, and at the same time, the error of the ratio is stricter, and the uniformity of the glue mixing is higher, which increases the difficulty of use; after the glue is dispensed, it needs to be baked for curing. The curing condition is 1-2h, and the ...

Claims

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Application Information

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IPC IPC(8): H01L33/56
CPCH01L33/56H01L2933/005
Inventor 洪汉忠
Owner HARVATEK OPTOELECTRONICS SHENZHEN
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