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Loan interview method and system

A loan face-to-face and face-to-face signing technology, applied in the fields of instruments, finance, data processing applications, etc., can solve the problems of low face-to-face signing efficiency and improve the efficiency of face-to-face signing.

Inactive Publication Date: 2017-08-18
PING AN TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a loan face-to-face signing method and system, aiming to solve the existing technical problem of low face-to-face signing efficiency

Method used

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  • Loan interview method and system
  • Loan interview method and system

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Experimental program
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Embodiment Construction

[0045] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0046] The invention provides a loan face-to-face signing method.

[0047] refer to figure 1 , figure 1 It is a schematic flowchart of the first embodiment of the loan face-to-face signing method of the present invention.

[0048] In this embodiment, an embodiment of the loan interview method is provided. It should be noted that although the logic sequence is shown in the flow chart, in some cases, the sequence shown here can be executed in a different order. or the steps described.

[0049] The loan face-to-face signing method of this application is applied to the first terminal and the second terminal. It should be noted that the system where the first terminal is located is the system where the real estate exchange is located. In the embodiment of the present invention, the system where the real estate exchange ...

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Abstract

The invention discloses a loan interview method and system, and the method comprises the steps: obtained the interview information needed in the interview process when a first terminal detects an interview request, and transmitting the interview information to a second terminal bound with the first terminal through a preset interface; obtaining the identity information of a user corresponding to the interview information and the needed contract information in the interview process when the second terminal receives the interview information; reminding an agent of the second terminal of checking the identity information and contract information, so as to obtain a check result; transmitting a checking result and a pre-stored load application table to the first terminal; and completing the interview process according to the received loan application table and check result through the first terminal. The method achieves the connection of systems corresponding to the terminals referred in the interview process. A user can complete the interview through bringing the data needed by the interview to a specific terminal, thereby improving the interview efficiency.

Description

technical field [0001] The invention relates to the field of financial technology, in particular to a loan face-to-face signing method and system. Background technique [0002] When borrowing from a financial institution, the lender needs to sign an interview with the financial institution. Face-to-face signing refers to the procedures in which the lender (together with the co-repayer or guarantor) brings the original legal and valid certificates, hand stamps and loan fees; pays the loan fees to the lending bank and conducts interviews and signatures. The face-to-face visa is a necessary procedure for applying for a loan from the bank. [0003] In the existing face-to-face signing process, users are required to bring the face-to-face visa information to the stores of various relevant institutions to handle corresponding businesses. For example, in the process of handling a housing loan, the user may need to go to the lending bank, the location of the real estate agent, and...

Claims

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Application Information

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IPC IPC(8): G06Q40/02
CPCG06Q40/03
Inventor 龙觉刚孙成冯心文佳梁瑾李明盛亮
Owner PING AN TECH (SHENZHEN) CO LTD
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