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Support-beam-type MEMS (micro electromechanical systems) fluid thermal conductivity and thermal diffusion coefficient sensor and preparation and testing methods thereof

A technology of thermal diffusivity and supporting beams, which is applied in the field of supporting beam MEMS fluid thermal conductivity and thermal diffusivity sensors and their preparation and testing, can solve the problems of increasing measurement errors and the influence of insulating layer films, etc., and achieve temperature rise small size, improve experimental accuracy, and simplify the test process

Active Publication Date: 2017-08-11
XI AN JIAOTONG UNIV
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Problems solved by technology

However, for the measurement of conductive liquids, the additional insulating film will increase the measurement error, especially when the measurement frequency is too high, the heat penetration depth will become smaller, and the insulating film will have a greater impact on the measurement results

Method used

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  • Support-beam-type MEMS (micro electromechanical systems) fluid thermal conductivity and thermal diffusion coefficient sensor and preparation and testing methods thereof
  • Support-beam-type MEMS (micro electromechanical systems) fluid thermal conductivity and thermal diffusion coefficient sensor and preparation and testing methods thereof
  • Support-beam-type MEMS (micro electromechanical systems) fluid thermal conductivity and thermal diffusion coefficient sensor and preparation and testing methods thereof

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Embodiment Construction

[0051] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0052] refer to figure 1 , the supporting beam type MEMS fluid thermal conductivity and thermal diffusivity sensor disclosed by the present invention comprises a substrate 1, including a substrate 1, a composite support film layer is provided on the upper and lower surfaces of the substrate 1, and the composite support film layer on the upper surface of the substrate 1 A heater 4 and a pad 6 are arranged on the supporting film layer, and the heater 4 and the pad 6 are connected through a lead 9; an insulating layer film 5 is also provided above the composite supporting film layer on the upper surface of the substrate 1, and the insulating layer film 5 covers heater 4 and pad 6;

[0053] In the thickness direction of the composite support film layer and the insulating layer film 5 on both sid...

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Abstract

The invention discloses a support-beam-type MEMS (micro electromechanical systems) fluid thermal conductivity and thermal diffusion coefficient sensor and preparation and testing methods thereof; a heater is arranged at the center of the upper surface of a substrate, a pad is arranged beside the heater on the upper surface of the substrate and is connected to the heater, film of an insulating layer covers the heater, the pad and the substrate, the film of the insulating layer is provided with cavities on two sides of the heater, the bottom of the substrate is provided with a back cavity, and a support beam structure is formed. The heater also acts as a temperature sensor; the heater is of elongated strip structure and is connected to the pad through four leads; by using the back cavity, a fluid under test is used as a substrate of the sensor, thermal conductivity and thermal diffusion coefficient of the fluid under test can be measured directly, and the test process is simplified. The sensor provided herein is suitable for measuring the thermal conductivity and thermal diffusion coefficient of conductive and nonconductive trace liquids.

Description

technical field [0001] The invention belongs to the technical field of sensors for measuring thermal conductivity and thermal diffusivity, and in particular relates to a support beam type MEMS fluid thermal conductivity and thermal diffusivity sensor and a preparation and testing method thereof. Background technique [0002] Thermal conductivity and thermal diffusivity are important thermophysical parameters of substances. The measurement and application of thermal conductivity and thermal diffusivity have been deeply studied internationally. In recent years, with the rapid development of nanotechnology, MEMS (Micro Electro-mechanical Systems, micro-mechanical electronic systems), low-dimensional materials, nano-biotechnology and other high-tech development, many research objects have entered the submicron or even nanometer scale. The demand for measurement of thermal and physical parameters of liquid samples has increased. [0003] Commonly used liquid thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20G01N25/18
CPCG01N25/18G01N25/20
Inventor 赵立波黄祥祥夏勇徐廷中郭鑫罗运运
Owner XI AN JIAOTONG UNIV
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