Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Outline printing

A contour and layout technology, applied in printing, printed circuit, printed circuit manufacturing, etc., can solve the problems of occupying printed circuit board production, long time interval of production time, time-consuming inspection and processing, etc., to achieve accurate external dimensions and reduce impact Effect

Inactive Publication Date: 2017-07-21
MUTRACX INT
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disadvantage of the disclosed system is that although this works simultaneously, the total production time of each substrate still requires too long a time interval
Inspection and processing of batches of substrates is time consuming and takes up production of printed circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Outline printing
  • Outline printing
  • Outline printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0115] Various embodiments of the present invention are described using FIGS. 1-7 .

[0116] Figure 1A A flow diagram of the method according to the invention is shown. In this method, the pattern layout L is received by the control electronics of the inkjet system. The control electronics contain software to convert the pattern layout into ink patterns. The software contains logic L to convert the received pattern layout L into a single contour layer comprising at least one contour portion and a single inner region layer comprising at least one inner region portion of the pattern layout. Logic L provides output data used to control at least one printhead of the inkjet system. Logic L provides first output data 1 and second output data 2 . The first output data 1 comprises contour data for printing the contour defined in the contour layer. The second output data 2 comprises inner region data for printing the inner region defined by the inner region layer. The outer outli...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to outline printing. In a method of using a printing algorithm to print an ink pattern on a substrate in an ink jet system, a received pattern layout is divided into a discrete outline and a discrete inner area. The discrete outline is printed before the discrete inner area is printed. The printing algorithm may include converting the outline into a covering algorithm of a group of covering elements before generating a group of ink droplet positions. Apart from the printing algorithm, an ink flow algorithm used for considering ink flow influence before a group of ink droplet positions are generated may also be included.

Description

[0001] This application is a divisional application of an invention application filed on December 28, 2012, with application number 201280071043.8 and titled "Inkjet System for Printing Printed Circuit Boards". technical field [0002] The present invention generally relates to apparatuses, methods and uses for the manufacture of substrates comprising ink patterns. In particular, the present invention relates to several aspects of methods and inkjet systems for manufacturing printed circuit boards by printing ink patterns on substrates. Background technique [0003] US2007 / 0154081 discloses a system for checking and verifying circuits. The system has a chassis that includes a first station with automated optical inspection (AOI) equipment that performs AOI of an electrical circuit to identify defects of candidate objects on the electrical circuit. Further, the chassis includes a second station having verification equipment that performs verification of defects of candidate ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/00B41J2/01
CPCB41J2/01B41J2/165B41J3/407B41M5/0047B65G54/00H05K3/06B41J2/16535B41J2/16541G01N21/956H05K3/125H05K2203/1344H05K2203/013G01N2021/95638B65G2201/022G01N21/95607H05K3/0079H05K3/061G01N2021/95615H05K2203/1563H05K2203/1572H05K2203/162H01L2924/0002B41J2/16538B41J2/16544B41J2/2132B41J25/001B41J3/60H01L2924/00H05K3/22H05K1/092B05B1/08B05B12/16B05B13/0221H01L21/288H01L22/12H01L23/544H05K2203/1461H05K2203/163H05K2203/16
Inventor 亨克·扬·兹维尔斯雅各布斯·亨德里克斯·约翰内斯·扬森约斯·安妮·费尔曼
Owner MUTRACX INT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products