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A Modeling Method of LED Lamps Considering the Correlation Between Modules

A technology of LED lamps and modeling methods, applied in CAD numerical modeling, instruments, design optimization/simulation, etc.

Active Publication Date: 2019-06-28
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In the prior art, there is no suitable modeling method for LED lamps

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  • A Modeling Method of LED Lamps Considering the Correlation Between Modules
  • A Modeling Method of LED Lamps Considering the Correlation Between Modules
  • A Modeling Method of LED Lamps Considering the Correlation Between Modules

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Embodiment Construction

[0048] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0049] The present invention provides a technical solution: a modeling method for LED lamps considering inter-module correlation, including:

[0050] Reliability structure analysis of LED lamps;

[0051] LED performance degradation mechanism and its mathematical model;

[0052] Performance degradation of the power module and its mathematical model;

[0053] The impact of random impact on the structure of LED lighting system;

[0054] System-level modeling that considers correlation and directional propagation of performance degradation;

[0055] LED lighting reliability design optimization;

[0056] Get the performance degradation model.

[0057] The reliability structure analysis of LED lamps refers to: the LED lamp system includes LED chip,...

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Abstract

The invention provides a modeling method of an LED lamp considering correlation between modules. The method comprises the following steps: performing reliability structure analysis of an LED Lamp; building a performance degradation mechanism and a mathematical model thereof of the LED; building a performance degradation and mathematical model thereof of a power module; calculating the influence of random shocks on each structure of an LED lamp system; considering the correlation of performance degradation and system-level modeling of directional propagation; performing reliability design optimization of the LED lamp; and obtaining a performance degradation model. Compared with the prior art, the modeling method of the LED lamp considering the correlation between the modules provided by the invention has the following beneficial effects: multi-objective optimization is achieved by using an evolutionary algorithm, a non-dominated solution set of optimization problems is obtained, and lamp manufacturing enterprises choose the most suitable solution in the non-dominated solution set. The method provides a powerful system reliability design and optimization tool for the lamp manufacturing enterprises.

Description

technical field [0001] The invention relates to a modeling method of an LED lamp considering the inter-module correlation, and belongs to the technical field of LED lamps. Background technique [0002] LED lamps are a system composed of multiple modules, and the performance of each module is degraded continuously. According to the current LED life calculation method generally accepted in the industry, the time when the LED light decay drops to a certain percentage of the initial value is the LED lamp. The definition of life, that is, the life of LED lamps is determined by the light decay of the LED chip. The light decay characteristics of the LED chip are not only affected by its own process quality, but also the performance of other modules will have a great impact on its light decay. Therefore, the modeling of LED lamps is theoretically a system modeling problem that considers multiple modules with performance degradation characteristics and external impacts. [0003] For...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/20G06F2111/10
Inventor 吕燚夏百战石世光
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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