Stacked mems sensor package, chip and manufacturing method thereof

Abstract

The invention discloses a stackable MEMS (Micro Electro Mechanical System) sensor package, a stackable MEMS sensor chip and a preparation method of the stackable MEMS sensor chip. The package comprises a cover plate, one or more acquisition wafers and one or more processing wafers, wherein the cover plate is used for packaging; acquisition circuits and MEMS structures are formed on the acquisition wafers; processing circuits are formed on the processing wafers; the processing wafers, the acquisition wafers and the cover plate are bonded by a wafer level bonding technology from the bottom up; and all the wafers are electrically connected by conductive bridge piers. According to the package, the chip and the preparation method, the acquisition circuits and the processing circuits are designed in layers, bonding and packaging are performed by the wafer level bonding technology and a vertical multi-layer stackable structure is formed, so that the area of the chip can be significantly reduced; complete isolation of the acquisition circuits and the processing circuits is realized; interference between analog circuits and digital circuits and circuit noise are reduced; a performance index of a sensor is increased; the acquisition circuits and the processing circuits can be separately processed by appropriate technologies, so that the technology cost of the sensor is lowered; and high-performance, small-size and low-cost terminal equipment is applicable.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a stacked MEMS sensor package, a chip and a manufacturing method thereof. Background technique [0002] A sensor is a device or device that can sense the measured information and convert it into an electrical signal or other required form of output according to a certain rule. Among a wide variety of sensors, MEMS sensors based on microelectronics and micromachining technologies have become one of the major scientific and technological fields that have attracted worldwide attention. Compared with traditional sensors, it has the characteristics of small size, low cost, low power consumption, easy integration and intelligent realization. At the same time, the feature size of the micron level makes it possible to complete some functions that cannot be realized by traditional mechanical sensors. [0003] The interior of the MEMS sensor mainly includes a MEMS structure for collectin...

AI Technical Summary

Problems solved by technology

The problems in the existing technology are: 1) The acquisition circuit and the processing circuit are mixed on the same wafer, and the digital and analog circuits will interfere with each other and the noise is large, which is difficult to control, resulting in low performance of the sensor; 2) The acquisition circuit and the processing circuit Mixing on the same wafer will make the size of the electronic component wafer too large, resulting in too large chip area, which is not conducive to application in small-volume scenarios such as hand-held and wearable; 3) The acquisition circuit (analog circuit) can be integrated at the micron level circuit production process, while the processing circuit (digital circuit) needs to adopt a nanoscale integrated circuit production process with higher cost. The existing technology integrates the acquisition circuit and the processing circuit on the electronic component wafer, in order to reduce the cost of the digital circuit. process, the entire electronic component wafer needs to adopt a more costly nanoscale production process, which ultimately leads to high cost of MEMS sensors

In short, the existing technical solutions seriously restrict the development of MEMS sensors in the direction of further intelligence, small size, high index, high performance and low cost.

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