Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PCB (printed circuit board) laminating process and PCB

A process, multi-layer board technology, applied in the direction of lamination, lamination device, layered products, etc., can solve the problems of different degrees of warpage, temperature difference, and unstable reliability of the board surface, so as to improve the material temperature difference, The effect of consistent lamination and stability

Active Publication Date: 2017-03-08
DONGGUAN SHENGYI ELECTRONICS
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the large difference in actual material temperature will lead to obvious temperature differences between the inner and outer PCB boards when they are turned to high pressure (differences of 10°C-20°C), large differences in heating speed, etc., and ultimately the same lamination press cannot be guaranteed. The inner layer board and the outer layer board have the same lamination state, which will have a great impact on the quality stability of the batch board. For example, the inconsistent curing conditions of PCB products lead to unstable reliability. After pressing the inner layer board and the outer layer board The uneven stress of the board leads to different degrees of warping of the board surface, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB (printed circuit board) laminating process and PCB
  • PCB (printed circuit board) laminating process and PCB
  • PCB (printed circuit board) laminating process and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] as table 1 and figure 2 As shown, in this embodiment, a PCB lamination process includes the following steps:

[0044] placing the laminated multi-layer board under the constant temperature and pressure conditions of the first temperature value and the first pressure value, and heating the multi-layer board after a first time interval;

[0045] lowering the temperature to a second temperature value, the second temperature value being less than the first temperature value, so that the multilayer board is placed under the constant temperature and pressure condition of the second temperature value and the temperature rises after a second time interval;

[0046] Elevate the temperature and pressure to press the multi-layer board.

[0047] In this embodiment, the material of the multilayer board is common FR-4. The material resin melting is between 70℃-80℃.

[0048] In this embodiment, the temperature is lowered to a second temperature value, and the second temperature va...

Embodiment 2

[0083] The difference between this embodiment and the first embodiment is that:

[0084] The PCB lamination process, the specific steps are as follows:

[0085] S20, stacking the outer layer board and the inner layer board into a multi-layer board.

[0086] S21, placing the multi-layer board into the laminating press.

[0087] S22. Use a lamination press to set a constant temperature of 135°C for 10 minutes; use a lamination press to set a pressure of 95 psi for 10 minutes.

[0088] S23. Use the lamination press to set the temperature to decrease to 85°C for 5 minutes, and then set it to maintain 85°C for 1 minute; use the lamination press to set the pressure of 95 psi, and the duration is 6 minutes.

[0089] S24, use the lamination press to set the temperature to 150° C. for 6 minutes; use the lamination press to set the pressure of 95 psi, and the duration is 6 minutes.

[0090] S25, use the lamination press to set the temperature to 210°C for 8 minutes, and then set to m...

Embodiment 3

[0096] The difference between this embodiment and the first embodiment is that:

[0097] The PCB lamination process, the specific steps are as follows:

[0098] S30, stacking the outer layer board and the inner layer board into a multi-layer board.

[0099] S31, placing the multi-layer board into the laminating press.

[0100] S32. Use a lamination press to set a constant temperature of 145°C for a duration of 14 minutes; use a lamination press to set a pressure of 105 psi for a duration of 14 minutes.

[0101] S33. Use the lamination press to set the temperature to 95°C for 7 minutes, and then set it to maintain 95°C for 3 minutes; use the lamination press to set the pressure of 95 psi, and the duration is 10 minutes.

[0102] S34, use the lamination press to set the temperature to 170° C. for 8 minutes; use the lamination press to set the pressure of 95 psi, and the duration is 8 minutes.

[0103] S35. Use the lamination press to set the temperature to rise to 220°C for 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses a PCB (printed circuit board) laminating process, comprising the steps of heating multiple boards that are stacked under first temperature and first pressure constantly; decreasing the temperature to second temperature that is less than the first temperature such that the multiple boards are heated under the second temperature and pressure constantly; increasing the temperature and pressure to laminate the multiple boards. The invention also discloses a PCB manufactured by using the laminating process. By using the PCB laminating process and the PCB, an actual material temperature difference between inner and outer boards of the PCB can be significantly improved, lamination states of the inner and outer boards are consistent, quality stability of batched boards is guaranteed, and consistent stress, namely, surface warping degree, of the inner and outer boards after laminating is ensured.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing process flow, in particular to a PCB laminate pressing process and PCB. Background technique [0002] With the improvement of PCB production efficiency, it is more and more common for production equipment to work at full load. Taking the lamination press as an example, since the temperature of the hot plate is conducted from the outer layer to the inner layer, the increase in the number of layers of the lamination press or the increase in the thickness of the PCB will highlight the inner and outer layers. The difference between the actual material temperature of the plate. The large difference in the actual material temperature will lead to a significant difference in temperature between the inner layer board and the outer layer board of the PCB when the high pressure is transferred (difference between 10 °C and 20 °C), and a large difference in the heating rate. In the end, the same la...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06
CPCB32B37/06B32B37/10B32B2457/08
Inventor 孙梁唐海波纪成光袁继旺陈正清
Owner DONGGUAN SHENGYI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com