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A kind of low-temperature heat-sealing air-resistant cpp aluminized film and preparation method thereof

A low-temperature heat-sealing and aluminized film technology, applied in chemical instruments and methods, flexible coverings, packaging, etc., can solve the problems of poor toughness, heat-sealing strength (weak barrier property, etc.), and achieve improved production efficiency and long-term quality Good protection and toughness

Active Publication Date: 2018-03-13
HUBEI DEWEI PACKAGING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The temperature of the heat-sealing layer of the existing aluminized film is high, the heat-sealing strength (barrier property) is still weak, and the toughness is poor

Method used

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  • A kind of low-temperature heat-sealing air-resistant cpp aluminized film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 As shown, a low-temperature heat-sealable gas-filled CPP aluminum-plated film is co-extruded by four layers of heat-sealing layer, first core layer, second core layer, and aluminum-plated layer arranged in sequence; The mass percentages of the layer, the first core layer, the second core layer, and the aluminized layer are 19%, 29%, 34%, and 18% respectively;

[0030] The material of the heat-sealing layer is composed of a mixture of ternary random copolymer polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and modifiers, and the mass percentages of each raw material are: Regular copolymer polypropylene (PP) resin 40%, ethylene-vinyl acetate copolymer (EVA) 40%, modifier 20%;

[0031] The material of the first core layer is made by mixing polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are respectively: polypropylene resin 65% and metallocene polyethylene 35%;

[0032] The material of th...

Embodiment 2

[0047] Such as figure 1 As shown, a low-temperature heat-sealable gas-filled CPP aluminum-plated film is co-extruded by four layers of heat-sealing layer, first core layer, second core layer, and aluminum-plated layer arranged in sequence; The mass percentages of the layer, the first core layer, the second core layer, and the aluminized layer are: 20%, 28%, 34%, and 18% respectively;

[0048] The material of the heat-sealing layer is composed of a mixture of ternary random copolymer polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and modifiers, and the mass percentages of each raw material are: Regular copolymer polypropylene (PP) resin 45%, ethylene-vinyl acetate copolymer (EVA) 45%, modifier 10%;

[0049] The material of the first core layer is made by mixing polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are respectively: polypropylene resin 70% and metallocene polyethylene 30%;

[0050] The material of t...

Embodiment 3

[0065] Such as figure 1 As shown, a low-temperature heat-sealable gas-filled CPP aluminized film is formed by co-extruding four layers of heat-sealing layer, first core layer, second core layer, and aluminized layer in sequence; The mass percentages of the layer, the first core layer, the second core layer, and the aluminum-plated layer are: 20%, 29%, 33%, and 18% respectively;

[0066] The material of the heat-sealing layer is composed of a mixture of ternary random copolymer polypropylene (PP) resin, ethylene-vinyl acetate copolymer (EVA) and modifiers, and the mass percentages of each raw material are: Regular copolymer polypropylene (PP) resin 50%, ethylene-vinyl acetate copolymer (EVA) 40%, modifier 10%;

[0067] The material of the first core layer is a mixture of polypropylene resin and metallocene polyethylene (linear), and the mass percentages of each raw material are respectively: polypropylene resin 75% and metallocene polyethylene 25%;

[0068] The material of the secon...

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Abstract

The invention belongs to the technical field of aluminum-plated films and provides a low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film. The invention is characterized in that, the low-temperature, heat-sealing and inflation-resistant CPP aluminum-plated film is formed through the co-extrusion process of four layers, namely a heat-sealing layer, a first core layer, a second core layer and an aluminum-plated layer, wherein the four layers are sequentially arranged and casted. The mass percentages of the heat-sealing layer, the first core layer, the second core layer and the aluminum-plated layer are respectively 19-20%, 28-29%, 33-34%, and 17-18%. The heat-sealing layer is prepared through mixing up ternary random copolymer polypropylene resin, ethylene-vinyl acetate copolymer (EVA) and a modifying agent. The first core layer is prepared through mixing up polypropylene resin and metallocene polyethylene. The second core layer is prepared through mixing up polypropylene resin, polyamide resin and low-density polyethylene. The aluminum-plated layer is prepared through mixing up copolymer resin and a reinforcing agent. An aluminum-plated film prepared through the above method is good in toughness, and the temperature of the heat-sealing layer can be reduced.

Description

Technical field [0001] The invention belongs to the technical field of aluminized films, and specifically relates to a low-temperature heat-sealable gas-filled CPP aluminized film and a preparation method thereof. Background technique [0002] The temperature of the heat-sealing layer of the existing aluminized film is relatively high, the heat-sealing strength (barrier property) is still weak, and the toughness is poor. Summary of the invention [0003] The purpose of the present invention is to provide a low-temperature heat-sealable gas-filled CPP aluminized film and a preparation method thereof. The aluminized film prepared by the method has good toughness and can reduce the temperature of the heat-sealed layer. [0004] In order to achieve the above objective, the technical solution adopted by the present invention is: a low-temperature heat-sealable gas-filled CPP aluminized film, which is characterized in that it consists of a heat-sealing layer, a first core layer, a second ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/32B32B27/30B32B27/18B32B27/06B32B27/08B32B33/00B65D65/40C08L23/14C08L23/08C08L23/12C08L23/06C08L77/06
CPCB32B27/08B32B27/18B32B27/306B32B27/32B32B27/327B32B33/00B32B2307/558B65D65/40C08L23/06C08L23/0853C08L23/12C08L23/14C08L2203/16C08L2205/02C08L2205/025C08L2205/03C08L2207/066C08L77/06C08K5/20
Inventor 蔡岩胜蔡扬龙刘桂华
Owner HUBEI DEWEI PACKAGING TECH
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