A debonding structure and method for an inertial sensor

Abstract

The invention discloses an adhesion eliminating structure of an inertial sensor and a method thereof. The structure comprises a driving device located in the movement direction of a mass block of the inertial sensor. The driving device fixedly installed relative to a stopping mechanism comprises an ejecting pin assembly making contact with the mass block. The driving device is arranged in the mode that when the mass block adheres to the stopping mechanism, the driving device moves, and the ejecting pin assembly is driven to separate the mass block from the stopping mechanism. According to the adhesion eliminating structure, after the mass block and the stopping mechanism adhere together, the driving device is controlled to move, and therefore the ejecting pin assembly can move in the direction of the mass block, finally, the mass block and the stopping mechanism are driven to be separated, adhesion elimination of the mass block is achieved, and the service life of the inertial sensor is prolonged. The adhesion eliminating structure can be designed by means of a redundant framework structure on the outer side of the mass block, and therefore the occupied area of a chip is not increased, and the overall size of the MEMS chip is not affected.

Description

technical field [0001] The present invention relates to an inertial measurement device, more specifically, to a disbonding structure in an inertial sensor; the present invention also relates to a disbonding method of an inertial sensor. Background technique [0002] Generally speaking, MEMS devices, especially MEMS inertial devices, generally use capacitance detection, which requires the design of complex mechanical structures. The mechanical structure of the MEMS inertial device includes an elastic beam 1a, a mass block 3a and an anchor point 2a. One end of the elastic beam 1a is fixed on the anchor point 2a, and the other end is fixed on the mass block 3a. In this way, under the action of inertial force, the mass Block 3a will have a displacement proportional to the inertial force, which will cause a change in the distance or the facing area between the movable capacitor plate and the fixed capacitor plate, thereby generating a change in capacitance and realizing the detec...

AI Technical Summary

Problems solved by technology

However, in practice, the implementation effect of this scheme is very poor

To make the electrostatic force exceed the adhesion force, it is necessary to apply a voltage of at least tens of volts, which will undoubtedly increase the difficulty of ASIC chip design. At the same time, it is necessary to design a large enough capacitance to provide a suitable electrostatic force, which requires a large amount of MEMS chips. area, so the method of electrostatic force contact adhesion has been abandoned

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