Waterproof temperature controller terminal pin and wire connecting method

Abstract

The invention discloses a waterproof temperature controller terminal pin and wire connecting method. A waterproof temperature controller comprises a waterproof jacket, an upper cover, a bimetal sheet, a guide frame, an ejector pin, a terminal A, a silver point A, a terminal B, a silver point B, a springboard, a housing, terminal pins, wires, epoxy resin glue and wire leading holes. The terminal pins are in a duplex notch structure; the inner wall of each terminal pin is provided with microgrooves, textures or sub-ribs; and the terminal pins are riveted to the wires, and are in melt sealing fixation via the epoxy resin glue. The terminal pin and wire connecting method comprises wire processing, terminal pin inner wall pressing, temperature control device preparation, pre-firm-sealing, temperature controller installation, die riveting and firm sealing. The terminal pins are riveted to the wires; the inner wall of the terminal pin at the notch is provided with the microgrooves, the textures or the sub-ribs, so that firmness is enhanced, the connection points do not loose with the change of temperature; and the fixed connection strength of the connection surfaces is enhanced through the textures or the sub-ribs, and thus the connection between the terminal pins and the wires is allowed to be firm and reliable in an ensured manner.

Description

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AI Technical Summary

Benefits of technology

This technology allows for securely connecting electrical components together without any loose parts caused during assembly process. It achieves this by creating an interference fit on both ends of each component's leads before they connect them into place. By doing these things, the joint becomes stronger overall while maintain its reliability even when exposed to different temperatures.

Problems solved by technology

This patents describes how current thermostatic devices have issues related to their reliability due to factors like poor connections caused by solubility differences during manufacturing and environmental concerns associated with these components. Additionally, existing solutions require multiple steps and involve expensive materials, making them difficult to implement on various applications where space constraints may limit usages.

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