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Rapid installing device for electronic components

A technology for electronic components and installation devices, which is applied in the field of rapid installation devices for electronic components, can solve the problems of low efficiency and achieve the effect of rapid installation

Inactive Publication Date: 2015-12-23
SUZHOU GUTESI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the long-distance transportation of electronic components in the process of automatic mass production of electronic components, in order to prevent scratches between electronic components and adjacent components, electronic components are often packaged into the casing, and the packaging into the casing is also for the follow-up The components are directly assembled and installed, but the electronic components packaged in the housing need to be packaged and filled with cushions during transportation, and the user disassembles them one by one after arriving at the destination, which has the problem of low efficiency

Method used

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  • Rapid installing device for electronic components

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Embodiment Construction

[0014] The quick installation device for electronic components of the present invention includes several casings 1 with built-in electronic components and a frame 2 for mounting the casings 1, and the frame 2 is provided with mounting grooves through which the casing 1 is partially embedded. Road 3, the section of the installation channel 3 is a dovetail groove shape, and the housing 1 is provided with a mounting part 11 embedded in the installation channel 3, and the cross section of the installation part 11 is a dovetail groove shape matching the cross section of the installation channel 3. By adopting the above-mentioned structure, fast installation can be completed by using the dovetail-shaped installation channel 3 to cooperate with the installation portion 11 provided on the housing 1 . In order to be able to install multiple sets of casings 1 , at least one installation channel 3 is provided on the frame 2 .

[0015] In order to further improve the anchoring strength of...

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Abstract

The invention discloses a rapid installing device for electronic components. The rapid installing device comprises a plurality of shells containing the electronic components and a rack for installation of the shells. The rapid installing device is characterized in that the rack is provided with left-right through installation channel where the shells are partially embedded. The cross section of the installation channel is in a dovetail groove type. Each shell is provided with an installation portion embedded into the installation channel. The cross section of each installation portion is in a dovetail groove type matched with the cross section of the installation channel. By the adoption of the structure, rapid installation can be achieved by machining the installation channel in the dovetail groove type with the installation portions arranged on the shells.

Description

technical field [0001] The invention relates to an electronic component installation device, in particular to a fast installation device for electronic components with high installation efficiency and convenient installation. Background technique [0002] During the long-distance transportation of electronic components in the process of automatic mass production of electronic components, in order to prevent scratches between electronic components and adjacent components, electronic components are often packaged into the casing, and the packaging into the casing is also for the follow-up The components are directly assembled and installed, but the electronic components packaged in the housing need to be packaged and filled with cushions during transportation, and the user disassembles them one by one after arriving at the destination, which has the problem of low efficiency. Contents of the invention [0003] The technical problem to be solved by the present invention is to...

Claims

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Application Information

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IPC IPC(8): B25B27/00
CPCB25B27/00
Inventor 金建华
Owner SUZHOU GUTESI ELECTRONICS TECH
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