Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system of detecting mutual connection between circuit boards, and mainboard

A technology of the first board and board, which is applied in the computer field and can solve problems such as poor contact, hard to find, and product failure.

Inactive Publication Date: 2015-11-18
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if more boards are plugged in, there will inevitably be poor contact after the boards are connected, resulting in product failure, and this problem is a hidden danger that is difficult to find in the design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system of detecting mutual connection between circuit boards, and mainboard
  • Method and system of detecting mutual connection between circuit boards, and mainboard
  • Method and system of detecting mutual connection between circuit boards, and mainboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] An embodiment of the present invention proposes a method for detecting the interconnection between boards, see figure 1 ,include:

[0042] Step 101: For the first PIN pin and the second PIN pin on the connector, arrange the connectors of the first PIN pin and the second PIN pin corresponding to the first board on the first board to be in the first level state ;

[0043] Step 102: Arranging the connectors of the first PIN pin and the second PIN ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and system of detecting mutual connection between circuit boards, and a mainboard. The method includes the steps: arranging joints, corresponding to a first circuit board, of a first pin and a second pin to be in a first level state for the first pin and the second pin on a connector; arranging joints, corresponding to a second circuit board, of the first pin and the second pin to be in a first level state; and detecting whether the level states of the first pin and the second pin both become second level states, determining that the first circuit board and the second circuit board are connected to each other successfully if the level states of the first pin and the second pin both become the second level states, otherwise, determining that the first circuit board and the second circuit board fail to be connected to each other. Through the technical scheme, people can detect whether the two circuit boards are connected to each other successfully.

Description

technical field [0001] The invention relates to computer technology, in particular to a method and system for detecting interconnections between boards and boards, and a main board. Background technique [0002] With the continuous development of servers and storage products, servers and storage have higher and higher functional requirements for products, and the number of functions is increasing, and the market requirements for product forms are also emerging, which results in a limited space. One board can no longer satisfy the realization of all functions. Therefore, it is necessary to change the original thinking and increase the area of ​​the boards by disassembling the boards and then plugging them into each other so that the product can support more functions. [0003] However, if more boards are plugged in, there will inevitably be poor contact after the boards are connected, resulting in product failure, and this problem is a hidden danger that is difficult to find...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/02
Inventor 唐传贞
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com