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Retest method based on test of multiple points around coordinate position of test point

A technology of multi-point testing and coordinate position, which is applied in the direction of electronic circuit testing, etc., can solve problems such as inability to completely eliminate misjudgment, achieve the effects of reducing mistesting, improving reliability, and solving misjudgment problems

Inactive Publication Date: 2015-10-14
THE 45TH RES INST OF CETC
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0005] The original retest method is to read the same test point coordinates from the test file for retesting. This method cannot completely eliminate the misjudgment caused by the position deviation of the test point, especially the inaccurate positioning caused by the manufacturing error. cause of misjudgment

Method used

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  • Retest method based on test of multiple points around coordinate position of test point
  • Retest method based on test of multiple points around coordinate position of test point
  • Retest method based on test of multiple points around coordinate position of test point

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Embodiment Construction

[0034] Below, the substantive features and advantages of the present invention will be further described in conjunction with examples, but the present invention is not limited to the listed examples.

[0035] see figure 1 , a method for retesting based on multi-point testing around the test point coordinate position, comprising the following steps:

[0036] S101: Carry out routine test to pad according to the TST test file of analysis, after routine test is finished, write the netlist information of the unqualified pad into the retest file;

[0037] The parsed TST test file is a test file with pad information, which is parsed and formed by the main program, and is formed through the following steps:

[0038] Analyzing the original process file, obtaining pad information and netlist information, judging the shape of the pad and recording pad shape information data, analyzing and generating the TST test file with pad information.

[0039] Specifically, see Figure 6 As shown,...

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Abstract

The invention relates to a retest method based on the test of multiple points around the coordinate position of a test point. The method comprises the steps that a routine test is carried out on a pad according to a parsed TST test file; after the routine test is completed, failed pad netlist information is written into a retest file; after the retest file is loaded, according to a preset test scale factor and the pad shape, the expanded test area of the pad to be retested is determined based on the coordinates of the pad, and based on stylus test points in the expanded test area and the number of times of tests, a new retest file is generated; and according to the new retest file, the pad to be retested is retested based on the stylus test points in the expanded test area and the number of times of tests. According to the invention, the retest method can automatically, efficiently and conveniently verify a test result of a flying probe test system; false tests are reduced; and the test reliability is improved.

Description

technical field [0001] The invention belongs to the technical field of double-sided flying probe testing, and in particular relates to a retesting method based on multi-point testing around the coordinate position of a test point. Background technique [0002] The double-sided flying probe test system is the key equipment in the manufacturing process of low-temperature co-fired ceramic (LTCC) substrates in PCB bare boards and micro-assembly production lines. carry out testing. The test process file IPC file used is edited and exported from the original design file through software such as CAM350. The information type of the line is marked with a number before each line of information in the file. The generated test file extracts the test points starting with 099. information. [0003] With the improvement of the integration degree of the micro-assembly production process, the size of the pads on the LTCC substrate and the spacing between the pads are getting smaller and sm...

Claims

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Application Information

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IPC IPC(8): G01R31/28
Inventor 左宁高慧莹李元升徐小飞
Owner THE 45TH RES INST OF CETC
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