Soaking type etching machine for glass substrate

Abstract

The invention provides a soaking type etching machine for a glass substrate. The etching machine comprises a trough body (10), a bottom bubbling plate (20) positioned at the bottom of the trough body (10), an inner frame (30) arranged in the trough body (10) and positioned on the bottom bubbling plate (20) and a plurality of layers of inner frame bubbling plates (40) arranged with a certain interval in the inner frame (30). Compared with the structure that a bubbling plate is only arranged at the bottom of a conventional etching machine, the etching machine provided by the invention has the following advantages: the trough liquor circulation in the trough can be strengthened; the resultants generated on the surface of the glass substrate are timely removed; the trough liquor circulation in the trough is enabled to be more uniform; water ripple and abnormal thickness etching are avoided.

Description

technical field [0001] The invention relates to the field of display manufacturing process, in particular to an immersion type glass substrate etching machine. Background technique [0002] In the field of display technology, liquid crystal displays (Liquid Crystal Display, LCD) have many advantages such as thin body, energy saving, and no radiation, and have been widely used, such as: mobile phones, personal digital assistants (PDA), digital cameras, computers, etc. screen or notebook screen, etc. [0003] A Thin Film Transistor (TFT) liquid crystal display generally includes a housing, a liquid crystal panel disposed in the housing, and a backlight module disposed in the housing. The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates, and control the liquid crystal molecules to change direction through whether the glass substrates are energized or not, and refract the light from the backlight mo...

AI Technical Summary

Problems solved by technology

[0006] See how figure 1 , the existing glass substrate immersion etching machine 100 only has a bubble mechanism 110 at the bottom to drive the bath liquid circulation, but the bubble mechanism 110 at the bottom cannot evenly remove the reaction product (Sludge) on the glass surface in time, and the glass The replacement rate of the surface etching solution is low. Once the bottom bubble mechanism 110 is deformed or some of the holes 111 are blocked, it will lead to abnormal etching, such as water ripples on the etched glass substrate, or abnormal thickness of the etched glass substrate

Furthermore, with the increase of glass generations, the size of the glass that needs to be thinned continues to increase. Compared with the G4.5 generation, the glass size of the G5.1 generation has increased from 730mm*920mm to 1200mm*1300mm. For the existing immersion type In the etching method, it is more difficult to drive the overall tank liquid circulation only through the bottom bubble mechanism, and the corresponding risk of abnormal etching is also increasing.

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