Internal space-optimized mobile phone

Abstract

The embodiment of the invention discloses an internal space-optimized mobile phone. The internal space-optimized mobile phone includes a printed circuit board (PCB), an auxiliary microphone (MIC), sealing foam, an flexible printed circuit (FPC), an adhesive layer and a shell, wherein the auxiliary MIC is arranged at the front surface of the PCB and is provided with a first sound incoming hole, the sealing foam is arranged at the front surface of the auxiliary MIC and is provided with a second sound incoming hole which is corresponding to the first sound incoming hole, the FPC is arranged at the upper side of the auxiliary MIC through the sealing foam and is provided with a third sound incoming hole and a light sensing device, the adhesive layer is provided with a fourth sound incoming hole which is aligned with the third incoming hole, and the back surface of the FPC is bonded on the shell through the adhesive layer. According to the internal space-optimized mobile phone, the utilization rate of the internal space of the mobile phone is increased, and a cavity sealing channel of the auxiliary MIC of the mobile phone can be simplified.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a mobile phone with optimized internal space. Background technique [0002] With the development of mobile communication technology, the number of mobile phones is increasing day by day and playing an increasingly important role in people's life and work. [0003] During the use of mobile phones, people often need to answer calls in different environments. Some noisy environments have a great impact on call quality. For example, when answering calls on buses and subways, the caller may not be able to hear clearly. , two microphones (Microphone, MIC) are arranged in the mobile phone, and one is main MIC, is arranged on the lower end of mobile phone, and another is auxiliary MIC, is arranged on the upper end of mobile phone, and two MICs play the effect of noise reduction. [0004] Generally, the main MIC and sub-MIC of the mobile phone are set on the printed circuit board (Pri...

AI Technical Summary

Problems solved by technology

[0004] Generally, the main MIC and sub-MIC of the mobile phone are set on the printed circuit board (Printed Circuit Board, PCB), the main MIC is set on the lower end of the PCB board, and the sub-MIC is set on the upper end of the PCB. figure 1 It is a schematic diagram of the structural distribution of the front side of the PCB board of the mobile phone in the prior art, such as figure 1 As shown, there are receiver 101, front camera 102, main camera 103, photosensitive device 104, earphone holder 105, antenna clearance area 106 and other large devices arranged side by side on the upper front of the PCB board 1 of the mobile phone, which can easily lead to space on the front of the upper PCB. Insufficient; so that there is no space for the secondary MIC of the mobile phone to be set on the front upper end of the PCB board, so the secondary MIC 202 of the mobile phone needs to be placed on the other side of the PCB board 1 ( figure 2 As shown), it is necessary to use a silicone sleeve to change the direction of the sound, and the sealing channel of the sound cavity is complicated

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