Electronic device shell assembly and manufacturing method thereof

A technology for housing components and electronic equipment, which is applied in the field of manufacturing process and manufacturing process of electronic equipment housing components, and can solve the problems of inability to conduct electricity and electrochemical treatment of metal shells, etc.

Inactive Publication Date: 2015-04-22
SAMSUNG TIANJIN MOBILE DEV CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, because the metal segments are separated from each other and cannot conduct electricity, the electrochemical treatment of the metal shell cannot be performed

Method used

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  • Electronic device shell assembly and manufacturing method thereof
  • Electronic device shell assembly and manufacturing method thereof
  • Electronic device shell assembly and manufacturing method thereof

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Embodiment Construction

[0028] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0029] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0030] The present application provides a method for manufacturing an electronic equipment housing assembly and the electronic equipment housing assembly manufactured by the method. The electronic device can be various electronic devices that can use metal casings, including...

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Abstract

The invention discloses an electronic device shell assembly and a manufacturing method of the electronic device shell assembly. The method comprises the first step of acquiring a metal shell, wherein the metal shell is composed of at least two metal segmenting components, and the adjacent metal segmenting components are connected through metal connecting components, the second step of combining the metal shell and insulating components, wherein the adjacent metal segmenting components are also connected through the insulating components, and the third step of conducting electrochemical treatment on the metal shell and then removing the metal connecting components to obtain the electronic device shell assembly. By means of the method, the metal shell is subjected to electrochemical treatment, and the communication performance of an electronic device is not influenced.

Description

technical field [0001] The present application relates to the field of manufacturing technology, in particular to the field of manufacturing technology of housing components of electronic equipment. Background technique [0002] Metal materials have many advantages such as good appearance and texture, good heat dissipation, strong hardness, and wear resistance. Therefore, as a new type of structural part, they are increasingly used in the casings of electronic devices such as mobile phones. In order not to affect the communication performance of the mobile phone, the metal shell can be segmented into multiple unconnected metal segment parts, so that the metal shell cannot form a closed connection structure. Multiple metal segmented parts can be connected by plastic parts to form a complete mobile phone casing. [0003] The existing production of mobile phone shells may include the following steps: casting molten metal to obtain a metal shell, which is composed of a pluralit...

Claims

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Application Information

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IPC IPC(8): H05K5/04B29C45/14C25D7/00
Inventor 杨俊彬
Owner SAMSUNG TIANJIN MOBILE DEV CENT
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