Electronic component recognizing method and system

Abstract

The invention discloses an electronic component recognizing method. The method comprises the steps of acquiring an electronic component image to be recognized, conducting feature point matching on electronic components on the electronic component image according to a specific model image, and recognizing the electronic component matched with the model image on the electronic component image when the electronic component image is successfully matched with the model image. The invention further provides an electronic component recognizing system. By the adoption of the technical scheme, automatic electronic component recognition is achieved, and recognition rate and recognition reliability are improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic component identification method and system. Background technique [0002] All kinds of electronic products are composed of electronic circuits with different functions printed on circuit boards, and the basic units that form electronic circuits are various electronic components (referred to as electronic components or electronic devices). During the production process of the circuit board, many electronic devices need to be packaged, and in the packaging process, the installation of other components is often affected by the wrong electronic devices. [0003] At present, the assembly process of electronic components on printed boards is mainly assembled according to the assembly drawing and list of electronic components in the work guidance documents such as process regulations. Especially in the printed board production line of small batches of electronic produ...

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Problems solved by technology

[0004] Because the circuit board components and electronic circuits are very different, and the distribution of various electronic components is different, it is very difficult to find the corresponding electronic component assembly position in the circuit board distribution of various electronic components, which is time-consuming and laborious. And manual inspection high error rate

With the rapid development of microelectronics technology, the high-density and miniaturized design of circuit boards and electronic components makes it more and more difficult for circuit board assembly operators and inspectors to identify the assembly positions of electronic components, and the error rate is getting higher and higher. There are more and more quality problems, which lead to prolonging the product production cycle, failing to deliver on schedule, and increasing production costs

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