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Three-dimensional surface topography measuring method for large-size workpiece

A three-dimensional surface and surface topography technology, which is applied in the direction of measuring devices, instruments, and optical devices, can solve the problem of sacrificing lateral resolution and achieve the effect of high lateral resolution information

Active Publication Date: 2014-12-10
LISHUI UNIV
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Problems solved by technology

In fact, in order to obtain high lateral resolution in a micro-interferometer, the lateral measurement range is often sacrificed, and to obtain a large lateral measurement range, the lateral resolution needs to be sacrificed

Method used

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  • Three-dimensional surface topography measuring method for large-size workpiece
  • Three-dimensional surface topography measuring method for large-size workpiece
  • Three-dimensional surface topography measuring method for large-size workpiece

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Embodiment Construction

[0097] like figure 1 As shown, the three-dimensional surface topography image measurement method of a large-scale workpiece includes the following steps:

[0098] 1) Use the white light wavelength scanning interferometry method to scan the surface of the workpiece. The white light wavelength scanning interferometry method acquires a series of sub-surface images. During the scanning process, the measured workpiece moves along a serpentine shape, and there are overlapping areas between adjacent sub-surface images. The subsurface images compose the sequence surface topography. After the measurement is completed, the adjacent images of an image can be known through the motion path, such as figure 2 As shown, for example, the adjacent images numbered 2 can only be numbers 1, 3, 4, 5, and 6. If there are sequence images above image 2, three more images need to be added in the same way. In the actual registration process, because numbers 1 and 3 are before and after the measuremen...

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Abstract

A three-dimensional surface topography measuring method for a large-size workpiece comprises scanning a workpiece surface through a white light wavelength scanning interferometry method, obtaining a series of sub-surface images through a white light wavelength scanning interferometry, wherein during the scanning process, the measured workpiece moves along a snake shape, zone overlapping is formed between the adjacent sub-surface images, and the sub-surface images form into sequence surface topographies; searching coordinate positions between the sequence surface topographies and dual mapping transformation in a gray level and enabling the sequence surface topographies to be aligned in topology and geometry; achieving accurate rectification of coordinates of the sub-surface images through a transform domain based rectification method; fusing a plurality of groups of sub-surface image data in overlapping zones of the two adjacent sub-surface images through a wavelet transform method and fusing the sub-surface images into a topology image. The three-dimensional surface topography measuring method for the large-size workpiece has the advantages of obtaining complete three-dimensional surface topography information of the large-size workpiece and enabling the image to have advantages of high lateral resolution information.

Description

technical field [0001] The invention relates to a method for measuring three-dimensional surface topography of large-scale workpieces. technical background [0002] With the development of science and technology, high-precision plane measurement requires larger and larger dimensions. In optical interferometry, the lateral resolution depends on the numerical aperture of the microscope, generally on the order of microns or submicrons; the lateral measurement range depends on the measurement field of view, and the size is on the order of millimeters. In fact, in order to obtain high lateral resolution in a micro-interferometer, the lateral measurement range is often sacrificed, and to obtain a large lateral measurement range, the lateral resolution needs to be sacrificed. Therefore, it is a technical problem that everyone is eager to solve in recent years to obtain complete three-dimensional surface topography information and make the subsurface image have high lateral resolut...

Claims

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Application Information

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IPC IPC(8): G01B11/25
Inventor 叶晓平游张平杨将新刘鸣洲
Owner LISHUI UNIV
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