Radio frequency and base band integrated circuit

Abstract

The invention provides a radio frequency and base band integrated circuit which comprises a sip chip (1) and external pins (2). The sip chip comprises a radio frequency chip (3) and a base band chip (4), and bonding pads (31) of the radio frequency chip (3) are connected with the external pins (2) through binding wires (5). Bonding pads (41) of the base band chip (4) are connected with the external pins (2) through binding wires (5). Bonding pads (32) of the radio frequency chip (3) are electrically connected with bonding pads (42) of the base band chip (4) through binding wires (5). The problem that an existing navigation chip is large in size can be effectively solved, besides, the research and development cycle of the product can be shortened, cost and risks are reduced, and market access of the product is accelerated.

Description

technical field [0001] The invention relates to the field of hardware, in particular to a radio frequency baseband integrated circuit. Background technique [0002] With the rapid promotion of the Beidou satellite navigation and positioning system, terminal applications on the market tend to be miniaturized and differentiated. This also requires that the size of the navigation chip must be reduced to meet various form requirements. [0003] In response to the above situation, there are currently some solutions, such as using a lower process to make the size of the navigation baseband chip smaller, using the Embedded RF (Embedded Radio Frequency, embedded radio frequency circuit) solution to make the radio frequency and the baseband into a bare chip , Using system-in-package technology to make RF chips and baseband chips into BGA (Ball Grid Array, spherical contact array, one of the surface mount packages) packaged SiP chips (System in Package, system-in-package), etc. But ...

AI Technical Summary

Problems solved by technology

[0008] Based on the above situation, the purpose of the present invention is to provide a radio frequency baseband integrated circuit, which can increase the testability of the radio frequency chip, increase the test coverage of the radio frequency and the internal interconnection of the baseband, and judge the internal interconnection of the chip at low cost, simply and quickly. The connectivity of wires can effectively solve the problems of risk introduced by system-in-package of RF chips and baseband chips, test complexity, and high cost of FT (Final test, chip final test)

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