Method for carrying out non-contact measurement on plane transformation by using low-dimensional nano material

Abstract

The invention discloses a method for carrying out non-contact measurement on plane transformation by using a low-dimensional nano material. The method specifically comprises the following steps: preparing materials; preparing systems; calibrating parameters; carrying out Raman measurement; and processing data. When the low-dimensional nano material serves as a sensing medium, stress sensing key parameters of the materials are obtained based on calibration and each stress component of a micrometer scale measuring point or full-field distribution of each plane stress component in a micro-region is directly measured by a polarization microscopic Raman instrument. Compared with a current relative technology, the method has the advantages that a Raman polarization sensitivity function of the specific low-dimensional nano material is not introduced, a common relation formula is given from a generalized angle, and a pure sensitive coefficient detected by calibration is used for representing a polarization selection characteristic of the nano material so that the dependency on the purity of a sensing medium material is completely eliminated and the method has a broad spectrum property and usability. The method can be used for relative application occasions of a plurality of fields including an experiment research of micro-scale mechanical behaviors, testing of mechanical properties of MEMS (Micro Electro Mechanical Systems) micro devices and the like.

Description

Technical field [0001] The invention belongs to engineering mechanics testing technology, and specifically relates to a method for measuring the amount of plane micro-scale deformation and its distribution law by means of spectroscopy. Background technique [0002] The measurement of mechanical properties of materials at the micro-scale is a hot or demanding point of current research in the field of materials engineering. Especially for the measurement of deformation of small devices with a scale below millimeters, there are many technical problems when the resolution is required to be higher than the millimeter scale. For example: for measuring resistance strain gauges, the resistance strain gauge is at least a few millimeters or more, and the measurement is a wired contact single-point measurement; the classic optical mechanics technology is mainly to measure the larger deformation field, but its The resolution is difficult to reach the micron level. In terms of microscopic me...

AI Technical Summary

Problems solved by technology

Otherwise, its measurement confidence and high sensing efficiency cannot be satisfied, and the measurement cost is high, the applicability is narrow, and the repeatability is not easy to guarantee

Although many different types of low-dimensional nanomaterials with Raman activity and strain sensitivity have been developed, similar to carbon nanotubes as sensing media, these materials also exist as sensing media due to low preparation levels. , leading to the problem that the material purity is difficult to conform to the theoretical model (ie, the purity dependence of the sensing medium)

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