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A kind of fabrication process of diode

A preparation process and diode technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as insufficient automation, hidden dangers in products, and long-term production

Active Publication Date: 2016-08-17
CHANGZHOUSR SEA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing diode products often have hidden dangers to the product, such as bending corners, in the production process. The reliability of the produced product is not ideal, and the degree of automation is not high enough, and the production time is relatively long.

Method used

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  • A kind of fabrication process of diode
  • A kind of fabrication process of diode

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Embodiment Construction

[0036] A kind of preparation technology of diode, comprises the following steps,

[0037] (1) Prepare the bottom sheet with the left frame strip and the right frame strip, the core particle storage tray with the core particles, and the tape-and-roll type top sheet with the bridge piece;

[0038] (2) The dispensing machine performs dispensing operations on the left frame strip and the right frame strip, so that the upper surfaces of the left frame strip and the right frame strip are glued with solder paste;

[0039] (3) Use the core particle pick-and-place mechanism to take out the core particle from the core particle storage tray and place it on the solder paste on the right frame bar;

[0040] (4) The dispensing machine applies glue to the core particles on the right frame strip, so that the upper surface of the core particles is glued with solder paste;

[0041] (5) Use the bridge pick-and-place mechanism to cut the bridge from the tape-type upper material and place it on t...

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Abstract

The invention relates to a preparation process of a diode. The main operation process is as follows: first assemble the left frame bar, the right frame bar, core grains and bridge pieces together through a dispensing process, and then perform welding, cleaning, drying, packaging, and cleaning , drying, testing, tinning, drying and packaging of the exposed parts of the frame strips, and invented a diode preparation process. The diodes produced are flat-angle surface mount type, and there are no hidden dangers to the product such as bent corners in the entire production process. The technology, the reliability and performance consistency of the product is high, and the performance of the product can be improved by adopting the bridging technology. The steps of the invention can realize mechanical automation, high production efficiency, stability and reliability.

Description

technical field [0001] The invention relates to a process for preparing a diode. Background technique [0002] Existing diode products often have hidden dangers to the product, such as corner bending, in the production process. The reliability of the produced product is not ideal, and the degree of automation is not high enough, and the production time is relatively long. Contents of the invention [0003] The purpose of the present invention is to provide a diode preparation process with high automation and high reliability. [0004] The technical scheme that realizes the object of the present invention is as follows: [0005] A kind of preparation technology of diode, comprises the following steps, [0006] (1) Prepare the bottom sheet with the left frame strip and the right frame strip, the core particle storage tray with the core particles, and the tape-and-roll type top sheet with the bridge piece; [0007] (2) The dispensing machine performs dispensing operations ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/329H01L21/50
CPCH01L24/90H01L29/6609H01L2224/83385H01L2224/83801H01L2224/84345H01L2224/84385H01L2224/84801H01L2924/181H01L2224/37147H01L2224/40245H01L2224/32245H01L2924/00012
Inventor 何永成刘伟
Owner CHANGZHOUSR SEA ELECTRONICS
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