Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cassette monitoring system

A technology for monitoring systems and cassettes, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer damage, mechanical stepping motor abnormalities that cannot be detected in time, and large-area wafer damage

Active Publication Date: 2016-06-08
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During this process, if the cassette on the loading platform is tilted, when the manipulator takes the wafer from the cassette or places the wafer into the cassette, it will collide with the adjacent wafer and the wafer will be damaged.
[0004] The conventional monitoring system of the film cassette is realized by physical contact with the film cassette. It is impossible to monitor the tilt of the cassette caused by the deformation of the cassette and the incomplete physical contact caused by the deformation.
In addition, there is also a lack of monitoring during the movement of the manipulator to the cassette to pick and place wafers, resulting in occasional mechanical stepping motor abnormalities that cannot be detected in time, easily causing large-area wafer damage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cassette monitoring system
  • Cassette monitoring system
  • Cassette monitoring system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Cassette monitoring systems such as figure 2 , image 3 As shown, including loading platform, manipulator, light source transmitter, light source receiver, processor;

[0029] The loading platform is used to place the cassette;

[0030] The manipulator is located on one side of the loading platform, and is used to pick and place wafers in the cassettes placed on the loading platform;

[0031] The light source emitter is fixed on the manipulator and is used to emit light parallel to the plane of the manipulator to the other side of the loading platform;

[0032] The light source receiver is arranged on the other side of the loading platform, and is used to receive the light emitted by the light source emitter, and output the light emitted by the light source emitter. The height Wch of the central point of the wafer blocking area, and the height Wsh of the side points of the wafer blocking area;

[0033] The processor is configured to output the thickness Wt of the b...

Embodiment 2

[0040] The light source emitter emits light parallel to the plane of the manipulator when the manipulator moves between the wafers in the cassette;

[0041] The light source receiver, when receiving light, also outputs a light arrival signal to the processor;

[0042] The processor, if the light arrival signal is not received within a set time after the movement of the manipulator to the wafers in the cassette, the processor outputs a manipulator failure alarm signal;

[0043] like Image 6 As shown, when the manipulator moves between the wafers in the cassette, the light source emitter emits light parallel to the plane of the manipulator. If the manipulator is normal, the light parallel to the plane of the manipulator is also parallel to the wafers in the cassette On the upper and lower surfaces, the light emitted by the light source transmitter will pass through the gap between the manipulator and the wafer surface, and be received by the light source receiver on the opposi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a film magazine monitoring system comprising a light source emitter, a light source receiver and a processor. The light source emitter is fixed on a mechanical hand and used for emitting light rays, which are parallel to the surface of the mechanical hand, to the other side of a loading platform. The light source receiver is arranged on the other side of the loading platform and used for receiving the light rays emitted by the light source emitter and outputting thickness of an area, which is blocked by a wafer, of the light rays emitted by the light source emitter, central point height of the area, which is blocked by the wafer, of the light rays emitted by the light source emitter, and height of one side point of the area, which is blocked by the wafer, of the light rays emitted by the light source emitter. The processor is used for outputting an alarm signal indicating forward and backward inclination or leftward and rightward inclination according to the thickness of the area blocked by the wafer, the central point height of the area blocked by the wafer, and the height of one side point of the area blocked by the wafer. The film magazine inclination state can be accurately monitored by the film magazine monitoring system.

Description

technical field [0001] The invention relates to wafer processing equipment, in particular to a cassette monitoring system. Background technique [0002] Common wafer processing equipment, such as WJ1000H (a wafer processing equipment product name of WatkinsJohnson Company), such as figure 1 As shown, it includes a loading platform 70 , a control system, a manipulator, a wafer conveyor belt, a process chamber 40 , and a return platform 60 . The arrows in the figure indicate the transmission line of the wafer. The wafer is placed in the cassette 30 and loaded onto the loading platform 70. Then the manipulator picks up the wafer, and sends the taken wafer into the wafer in the process chamber 40 inside the equipment. Processed on the circular conveyor belt, the processed wafers are sequentially delivered to the return platform 60 at the end of the equipment by the conveyor belt, taken out by the manipulator, and put back into the cassette 30 on the loading platform 70 . [00...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67259
Inventor 沈坚
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com