A Kovar metal structure and laser welding method for laser sealing welding

A technology of laser welding and sealing welding, which is applied in the direction of laser welding equipment, sealed casing, welding equipment, etc.

Active Publication Date: 2017-03-15
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the characteristic of parallel seam welding technology is that the shape of the cover plate of the welded cavity structure must be a regular plane figure (rectangle and circle). Once an irregular cover plate structure appears, parallel seam welding is powerless

Method used

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  • A Kovar metal structure and laser welding method for laser sealing welding
  • A Kovar metal structure and laser welding method for laser sealing welding
  • A Kovar metal structure and laser welding method for laser sealing welding

Examples

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Effect test

Embodiment 1

[0058] combine figure 1 -15. A Kovar metal structure for laser sealing welding. This embodiment is a regular geometrical structure. The cavity structure is a Kovar 4J33 material with a length of 20.00mm × width of 10.00mm × height of 5.00mm. Metal structure, the structure of the cover plate 3 is a Kovar metal structure made of 4J33 with a length of 19mm × width of 9mm × height of 0.50mm. The thickness of the cavity side wall 1 is 1 mm, so as to effectively reduce the space occupied by the cavity wall 1; Provide bearing support; the width of the step 2 is 0.5mm, so as to balance the size of the laser welding spot and the force of the support surface as much as possible; the height of the step 2 is 0.5mm; the thickness of the cover plate 3 is 0.5mm.

[0059] Preferably, the matching shape of the cavity and the cover plate 3 is a polygon, so as to meet the requirements of different hybrid integrated circuit sealing structures;

[0060]Preferably, the corners 5 of the cavity and...

Embodiment 2

[0064] combined with Figure 10 --15. Complete the design of the cavity and the cover plate 3 according to the design requirements of the module circuit. This embodiment is an irregular geometric structure. If such a structure is to be airtightly welded, parallel seams must not be used. Laser welding provides a good solution for such Kovar metal structures.

[0065] In order to reduce the processing difficulty and meet the requirements of later laser welding at the same time, the structure adopts a rounding treatment with a radius of 1.00mm.

[0066] In order to ensure that the gap 4 at the joint between the cavity and the cover plate 3 is not greater than 0.06 mm and as small as possible, the cover plate 3 is designed with positive tolerances.

[0067] A laser welding method, characterized in that it comprises the following steps:

[0068] Provide a Kovar metal structure for laser sealing welding;

[0069] Clean the cavity and the cover plate 3 with a cleaning solution to ...

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Abstract

The invention provides a Kovar metal structure and a laser welding method for laser sealing welding, which can maximize the effective area in the cavity, provide the largest space for the design of the mixed microcircuit in the cavity, and provide flexibility for the design of the circuit; On the one hand, combined with laser welding equipment, it provides a solution for the airtight sealing welding of regular and irregular Kovar metal cavity planar structures; this welding method has the following advantages: low heat input, resulting in small thermal influence It basically covers all kinds of metal materials; it will not cause thermal damage to heat-sensitive components; it does not need to be in direct contact with the workpiece; it can weld similar and dissimilar metals; it can seal and weld irregular patterns.

Description

technical field [0001] The invention relates to a Kovar metal structure for laser sealing welding and a laser welding method, and belongs to the technical field of sealing technology in microelectronic package packaging. Background technique [0002] With the rapid development of the electronics industry, miniaturization, high density, high speed, and high reliability have become the vane of the development of electronic products. On this basis, hybrid integrated circuit technology has developed rapidly. Hybrid integrated circuits must be hermetically sealed to prevent moisture, oxygen, and other environmental contamination from entering the interior of the packaged circuits to ensure long-term product reliability. [0003] The most common form of Kovar metal seal welding is through glove boxes and vacuum ovens with parallel seam welding equipment. However, the characteristic of parallel seam welding technology is that the shape of the cover plate of the welded cavity struc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/04H05K5/03H05K5/06B23K26/242B23K26/70
Inventor 吴华夏刘劲松洪火锋王华周宗明白卫星陶超
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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