Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Headset

An earphone and wire hole technology, applied in the direction of earpieces/earphone accessories, etc., can solve the problems affecting the sound output effect of the earphone, and achieve the effect of ensuring the sound output effect.

Inactive Publication Date: 2013-12-04
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the use of this earphone, the wire runs loosely through the wire hole. When the wire encounters an external force, the wire will move in the wire hole, causing the wire to collide with or scratch the inner wall of the wire hole to generate abnormal sound, thereby Affect the sound effect of headphones

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Headset
  • Headset
  • Headset

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] figure 1 and figure 2 Shown is an earphone 100 in an embodiment of the present invention, the earphone 100 includes a casing 10, a sounding unit 20 disposed in the casing 10, and a device for connecting the sounding unit 20 to an external circuit (not shown). A lead 30, an adhesive tape 40 (such as Figure 4 ) and a buffer sleeve 50 set on the adhesive tape 40 .

[0014] Please also refer to image 3 , the casing 10 is hollow and has a sound chamber 11 inside, and the pronunciation unit 20 is fixed in the sound chamber 11 . The casing 10 includes a rear cover 12 and a front cover 13 covering the rear cover 12 , the rear cover 12 and the front cover 13 enclose the sound cavity 11 .

[0015] The back cover 12 is provided with a wire hole 121 , and the wire hole 121 communicates with the sound cavity 11 . The rear cover 12 includes a cavity portion 122 and a handle portion 123 extending outward from the cavity portion 122 in a tapered shape. The wire hole 121 is dis...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A headset comprises a shell body, a sound producing unit and a wire, wherein the sound producing unit is arranged inside the shell body, and the wire is connected with the sound producing unit. A tune cavity is formed inside the shell body, the sound producing unit is arranged inside the tune cavity, a wire hole is formed in the shell body and is communicated with the tune cavity, the wire extends into the tune cavity from the wire hole, and the wire is wound by adhesive tape which abuts against the inner wall face of the wire hole in a connection mode to fasten the wire into the wire hole. According to the headset, the wire can be prevented from shaking inside the wire hole, and the sound producing effect is further improved.

Description

technical field [0001] The invention relates to an earphone, in particular to a wired earphone. Background technique [0002] The earphone usually includes a casing, a sounding unit arranged in the casing, and a wire connecting the sounding unit with an external circuit. The casing is provided with a sound chamber and a wire hole communicating with the sound chamber, the sounding unit is arranged in the sound chamber, and the wire enters the sound chamber through the wire hole to be connected with the sounding unit. In order to make it easier for the wire to enter the sound cavity, the diameter of the wire hole is usually larger than the wire diameter of the wire. During the use of this earphone, the wire runs loosely through the wire hole. When the wire encounters an external force, the wire will move in the wire hole, causing the wire to collide with or scratch the inner wall of the wire hole to generate abnormal sound, thereby Affects the sound output of headphones. C...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
Inventor 陈皇妙
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products