Vapor deposition device, vapor deposition method, and organic el display device
A technology of evaporation and evaporation source, applied in lighting devices, vacuum evaporation coating, sputtering coating, etc., can solve the problems of difficulty in achieving high precision, obstacles to productivity and safety, increase in weight, etc., and achieve display quality. Excellent, excellent reliability, blur suppression effect
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Embodiment approach 1)
[0163] Figure 10 It is a perspective view showing the basic configuration of the vapor deposition apparatus according to Embodiment 1 of the present invention. Figure 11 yes Figure 10 Front cross-sectional view of the vapor deposition device shown.
[0164] The vapor deposition unit 50 is constituted by the vapor deposition source 60 , the vapor deposition mask 70 , and the limiting plate unit 80 disposed therebetween. The substrate 10 moves at a constant speed along the arrow 10 a on the side opposite to the vapor deposition source 60 with respect to the vapor deposition mask 70 . For the convenience of the following description, it is assumed that the horizontal axis parallel to the moving direction 10a of the substrate 10 is the Y axis, the horizontal axis perpendicular to the Y axis is the X axis, and the vertical axis perpendicular to the X axis and the Y axis It is the XYZ orthogonal coordinate system of the Z axis. The Z axis is parallel to the normal direction o...
Embodiment approach 2)
[0193] Figure 15 It is an enlarged cross-sectional view of the vapor deposition apparatus according to Embodiment 2 of the present invention viewed in a direction parallel to the traveling direction of the substrate 10 . exist Figure 15 Among them, for the vapor deposition device shown in Embodiment 1 Figure 10 ~ Figure 12 Components that are the same as those shown in , are given the same symbols, and their descriptions are omitted. Hereinafter, Embodiment 2 will be described focusing on differences from Embodiment 1. FIG.
[0194] The second embodiment differs from the first embodiment in the cross-sectional shape of the limiting plate 81 of the limiting plate unit 80 along the XZ plane.
[0195] That is, if Figure 15 As shown, both ends in the vertical direction (Z-axis direction) of the side surface of the restricting plate 81 defining the restricting space 82 in the X-axis direction protrude toward the restricting space 82 , and the region between the two ends is ...
Embodiment approach 2
[0200] In addition, according to Embodiment 2, since the second surface 84b is formed below the first surface 84a (the vapor deposition source 60 side), even if a large amount of vapor deposition material adhering to the first surface 84a peels off and falls, the Since the vapor deposition material also falls on the second surface 84b and is captured, the possibility of falling on the vapor deposition source 60 is reduced. When the vapor deposition material peeled off from the restricting plate 81 falls on the vapor deposition source 60 and evaporates again, vapor deposition particles may adhere to undesired positions of the substrate 10 . In addition, when the vapor deposition material peeled off from the restricting plate 81 falls on the vapor deposition source opening 61 , the vapor deposition source opening 61 is blocked, and a film cannot be formed on a desired position of the substrate 10 . According to the second embodiment, the possibility of occurrence of such trouble...
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