Automatic pick-and-place machine for micro elements

Abstract

The invention provides an automatic pick-and-place machine for micro elements. The automatic pick-and-place machine for the micro elements solves damage problems that electronic elements are polluted by impurities and even deformed and injection-molding objects are broken and cracked, resulting from manual picking and placing, in the prior art. The automatic pick-and-place machine for the micro elements solves damage problems comprises a base with a bearing platform; the base is provided with a transverse conveying mechanism and a longitudinal conveying mechanism, which are positioned perpendicularly; moreover, the longitudinal conveying mechanism is arranged above the transverse conveying mechanism in a crossing manner; the transverse conveying mechanism is in sliding connection with a tray in the transverse direction; the longitudinal conveying mechanism is in sliding connection with a vacuum pick-and-place mechanism in the longitudinal direction; the vacuum pick-and-place mechanism is suspended above the tray and is further connected with a vacuum generation device which is fixedly arranged on the base; and moreover, the base is fixedly provided with a control device for controlling the mechanisms or devices to act cooperatively. According to the automatic pick-and-place machine for the micro elements, the pick-and-place area is expanded, the pick-and-place paths are enriched, and meanwhile, the intactness of the electric elements can be guaranteed; and the protection efficiency is improved and the operating accuracy is improved.

Description

Technical field [0001] The invention belongs to the field of electronic information technology, and relates to a pick-and-place conveying structure, in particular to an automatic pick-and-place machine for micro-components. Background technique [0002] With the rapid development of my country's social economy and technology, the technology of electronic products is becoming more and more technological and advanced, and people are more inclined to the demand direction of multiple functions, concentrated performance and convenient portability. As a result, the development trend of electronic products is getting smaller and smaller, more sophisticated and integrated. Therefore, the important electronic components inside are also developing in the direction of thinness, smallness and lightness. [0003] Take the connector of the mobile phone memory card as an example. The thickness of the DUAL SOCKET series connector combined by the memory card and the SIM card is 2.7mm, and the leng...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the above-mentioned problems in the existing technology, and propose a method to realize the horizontal and vertical transportation of micro components through fully automatic mechanization, and use vacuum suction and delivery methods to completely avoid the problems of micro components being polluted and damaged. , At the same time, the precise control of the program improves the accuracy and production efficiency of the micro-component automatic pick-and-place machine

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